The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn–Ag–Cu solder on OSP-Cu pads

Gain, Asit Kumar; Chan, Y.C.

doi:10.1016/j.intermet.2012.04.019

Cited by 55 publications

(36 citation statements)

References 26 publications

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“…[15][16][17][18][19] It was shown that minor metal nanoadditions have an impact on the microstructure of solidified SAC solders, but practically without any significant change of the melting temperatures. [15][16][17] Calorimetric measurements revealed that additions of Co in bulk and nanosized form to a liquid Sn-3.8Ag-0.7Cu alloy resulted in additional heat effects during melting of the Co nanoparticles compared to those in bulk form.…”

Section: Introductionmentioning

confidence: 99%

“…[18,[20][21][22][23] However, to the best of our knowledge, there are no literature data related to the structure and thermophysical properties of nanocomposite SAC solders with nano Ni additions in the liquid state after melting. In this work, we carried out investigations of the electrical conductivity of nanocomposite SAC in the liquid state.…”

Section: Introductionmentioning

confidence: 99%

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Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range

Yakymovych

Plevachuk

Sklyarchuk

et al. 2017

J. Phase Equilib. Diffus.

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The electrical conductivity of nanocomposite Sn-3.0Ag-0.5Cu alloys with two different weight percentages of Ni nanoparticles (1.0 and 2.0 wt.%) was measured over a wide temperature range. The samples were produced using a cold pressing method: Sn-3.0Ag-0.5Cu powder and Ni nanopowder were mechanically mixed and pressed into 8 mm diameter rods. Ni nanoparticles were synthesized via a chemical reduction method and characterized by a core/ shell structure. Temperature dependencies of the electrical conductivity revealed a hysteresis between the heating and cooling curves in a wide temperature range above the melting temperature. This fact is connected with structure transformations accompanied by a dissolution of Ni nanoparticles, which should be retarded due to an oxide/ hydroxide shell on the surface of the nanoparticles. A microstructure analysis of the samples in the solid state showed a fine distribution of intermetallic compounds in the Sn-based matrix. The Ni atoms substituted for Cu atoms in the Cu 6 Sn 5 compound forming a (Cu,Ni) 6 Sn 5 phase.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range

Yakymovych

Plevachuk

Sklyarchuk

et al. 2017

J. Phase Equilib. Diffus.

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“…It was found that 30 min should be enough to achieve a homogeneous distribution of NPs in the solder paste. 6,7 The O 4 Sn; Alfa-Aesar) were dissolved in diethylene glycol (DEG; Alfa-Aesar) as the metal precursors. The average size of the produced Ni and Ni-Sn NPs was about 100 nm ( Fig.…”

Section: Methodsmentioning

confidence: 99%

“…4 presents the cross-sectional microstructure of solder/Cu solder joints without (a) and with 1.0 wt.% Ni (b), Ni 3 Sn (c) and Ni 3 Sn 2 (d) nanoinclusions, respectively. This phenomenon can be explained by the assumption that Ni and NiSn particles were completely dissolved during the ramp and the reflow and (Ni,Cu) 6 Sn 5 crystals were formed during cooling. At the same time, no traces of Ni were found in the Cu 3 Sn and Ag 3 Sn phases.…”

Section: Microstructure Analysismentioning

confidence: 99%

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Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

Yakymovych

Švec

Orovčík

et al. 2017

Journal of Elec Materi

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This study investigates the effect of minor additions of Ni, Ni 3 Sn or Ni 3 Sn 2 nanoparticles on the microstructure and mechanical properties of Cu/solder/ Cu joints. The nanocomposite Sn-3.0Ag-0.5Cu (SAC305) solders with 0.5, 1.0 and 2.0 wt.% metallic nanoparticles were prepared through a paste mixing method. The employed Ni and Ni-Sn nanoparticles were produced via a chemical reduction method. The microstructure of as-solidified Cu/solder/Cu joints was studied by x-ray diffraction and scanning electron microscopy. The results showed that additions of Ni and Ni-Sn nanoparticles to the SAC305 solder paste lead initially to a decrease in the average thickness of the intermetallic compound layer in the interface between solder and substrate, while further additions up to 2.0 wt.% did not induce any significant changes. In addition, shear strength and microhardness tests were performed to investigate the relationship between microstructure and mechanical properties of the investigated solder joints. The results indicated an increase in both of these properties which was most significant for the solder joints using SAC305 with 0.5 wt.% Ni or Ni-Sn nanoparticles.

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Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints

Sona

Prabhu

2013

J Mater Sci: Mater Electron

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The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn–Ag–Cu solder on OSP-Cu pads

Cited by 55 publications

References 26 publications

Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range

Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range

Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints

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