“…There are two MOS scaling theories: Constant Electric (CE) field scaling [19] and Constant Voltage (CV) scaling [18]. In CE scaling, it has been proposed that for keep the short channel effect under control, the horizontal and vertical dimensions should be scaled down.…”
Section: Variability-aware Design Of Subthreshold Devicesmentioning
confidence: 99%
“…The CV theory retains the same scaling down theory as the CE, but the power supply voltage remains unchanged. Therefore, to maintain the charge-field, the doping densities are increased by a factor of S 2 [18]. However, the CV scaling inherently leads to a continuous increase of the transistor's internal electric field, which can cause reliability problems such as electron migration, hot carrier degradation, and oxide breakdown in recent CMOS process generations.…”
Section: Variability-aware Design Of Subthreshold Devicesmentioning
“…There are two MOS scaling theories: Constant Electric (CE) field scaling [19] and Constant Voltage (CV) scaling [18]. In CE scaling, it has been proposed that for keep the short channel effect under control, the horizontal and vertical dimensions should be scaled down.…”
Section: Variability-aware Design Of Subthreshold Devicesmentioning
confidence: 99%
“…The CV theory retains the same scaling down theory as the CE, but the power supply voltage remains unchanged. Therefore, to maintain the charge-field, the doping densities are increased by a factor of S 2 [18]. However, the CV scaling inherently leads to a continuous increase of the transistor's internal electric field, which can cause reliability problems such as electron migration, hot carrier degradation, and oxide breakdown in recent CMOS process generations.…”
Section: Variability-aware Design Of Subthreshold Devicesmentioning
“…35 Um have not produced any evidence of ballistic transport. An interesting phenomenun associated with potential barriers at the source-channel and drain-channel junctions was observed.…”
Section: Taskmentioning
confidence: 99%
“…In addition, with smaller probability of hole impact ionization at the drain end, 35 it may not be necessary to have a lightly doped region. Therefore, no distinction has been made in our analysis between shallow and deep source/drain regions for a p-channel device.…”
Section: Recently Scott Et Al1° Have Extended the Transmission Linmentioning
confidence: 99%
“…We have examined L -0. 35 jsm MOSFETs produced by vertical etch technique" between 18" and 300"K with no evidence of ballistic transport.…”
Section: Section VI Low Temperature Measurementsmentioning
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