The impact of oxygen content on the reliability of Au-20Sn solder hermetic package

Wang, Liujue; Xue, Songbai; Lin, Yaowei; Chen, Hongneng

doi:10.1016/j.vacuum.2020.109754

Cited by 4 publications

(3 citation statements)

References 20 publications

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“…28) The microstructure of a solder joint deteriorates significantly when the oxygen content is too high in the joint. 65) The formation of oxides on the solder surface will be promoted by the high oxygen content in Au20Sn solder, leading to porosity and cracks that can occur during reflow, thereby the reliability of the solder joint is decreased. 30) The Au 20Sn solder joints had good microstructure with the oxygen content level of 16 ppm.…”

Section: Mechanical Propertiesmentioning

confidence: 99%

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Wang

Zhang

2022

Mater. Trans.

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The requirements for electronic devices in high-temperature environment such as avionics and automotive have promoted the development of high-temperature solders. The Au20Sn solder, which is one of the hot topics of the current research in the field of electronic packaging, is widely used in flip-chip, light-emitting diode and hermetic package fields because of its good creep resistance, corrosion resistance and flux-free soldering. Recent research about the microstructure, wettability, interfacial intermetallic compounds, and mechanical properties of Au20Sn solder were reviewed. This paper focuses on the interfacial reaction of Au20Sn with different substrates and the mechanical properties of Au20Sn solder joints. In addition, the current research shortages of Au20Sn solders and the development directions are presented.

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Section: Mechanical Propertiesmentioning

confidence: 99%

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Wang

Zhang

2022

Mater. Trans.

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“…As defined by MIL-STD-883C, a hermetic package means the leak rate of helium after pressurization is below the rate specified with reference to the package size. Improper sealing methods or parameters will cause function loss, not only hermetic failure but also electrical or physical failure [5]. The method for sealing the lid with the base plays a key role in the reliability of the package.…”

Section: Introductionmentioning

confidence: 99%

A new method for preventing stress cracking in repairable ceramic packages by changing the sealing ring shape

Yao,

Tian,

Fang

et al. 2023

Mater. Res. Express

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High-reliable ceramic packages are impressionable to the parallel seam welding (PSW) parameters leading to low yield and reliability. In this study, the structure of the ceramic package was modified by changing the sealing ring to improve weldability and high-temperature reliability. Three types of ceramic packages with different-shaped sealing rings, which are conventional rectangular rings, notch inward rings, and notch outward rings, were fabricated by Au-Sn soldering and a follow-up PSW process. The packages with the rectangular ring failed in the subsequent high-temperature aging test. The packages with the notch inward ring exhibited an early failure after PSW. Cracks were generated in the Au-Sn solder and propagated into the ceramic substrate. The packages with the notch outward ring exhibited remarkable weldability and reliability. Sequential thermo-structural coupling was used to simulate the temperature and stress distribution in the packages. The maximum principal stress in the aforementioned ceramic substrates rapidly increased to approximately 170.0 MPa, 168.5 MPa and 101.4 MPa in the PSW process. Stress concentration existed at the outside corner around the rectangular and notch inward-shaped sealing rings. The maximum temperature at the local position in the ceramic was raised to 250.3 °C, 238.6 °C and 157.2 °C depending on the shape of the sealing ring. The extra transmission path in the notch outward ring relieved thermal mismatch and deformation at the Au-Sn/ceramic interface during PSW. The packages with notch outward rings were recommended especially in the repairable ceramic packaging.

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“…High-Pb solders (e.g., 95Pb-5Sn (wt.%)) as high-temperature solders possess excellent soldering properties in electronic packaging and step soldering applications. Lead is harmful to both the environment and human health, and, thus, the use of high-Pb solders has been restricted [1][2][3]. The Au-Sn-based alloys have been proposed as alternative high-temperature Pb-free solders [4,5].…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic Description of the Au-Sb-Sn Ternary System

Tong

Rong

et al. 2023

Metals

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Phase equilibria and thermodynamic properties of the Au-Sb-Sn ternary system are important for the design of Au-based alloys as high-temperature lead-free solders to replace high-Pb solders. In this work, phase transition temperatures of five Sb-Sn alloys were measured using differential thermal analysis (DTA), and the temperatures of three invariant reactions were determined. Based on the measured experimental results in this work and the reported results, the Sb-Sn binary system was re-optimized using the CALPHAD method. The calculated results were in good agreement with available phase equilibria and thermodynamic data. This work was further combined with the previous assessments of the Au-Sn and Au-Sb binary systems and the present optimization of the Sb-Sn binary system to calculate the phase equilibria and thermodynamic properties of the Au-Sb-Sn ternary system, according to the reported experimental results, including thermodynamic properties and phase equilibria. The calculated liquidus projection, isothermal sections, vertical sections, as well as enthalpy of mixing and activity of Sn in liquid alloys are consistent well with the reported experimental results. A self-consistent set of thermodynamic parameters was obtained to accurately describe Gibbs energies of various phases in the Au-Sb-Sn ternary system, which would serve as a sound basis for developing a thermodynamic database of multicomponent Au-Sn-based alloy systems.

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The impact of oxygen content on the reliability of Au-20Sn solder hermetic package

Cited by 4 publications

References 20 publications

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

A new method for preventing stress cracking in repairable ceramic packages by changing the sealing ring shape

Thermodynamic Description of the Au-Sb-Sn Ternary System

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