“…Attempts to control the morphological instabilities of Li metal anodes at the SSE interface have also been made by introducing other interfacial materials, such as Li alloys − or Li-hosting scaffolds. − Alloy materials at the Li-SSE interface can beneficially affect both Li plating and stripping. Materials such as silver and gold form Li alloys and can reduce the nucleation overpotential for Li metal deposition, which enables homogeneous Li growth during deposition. ,, However, in the case of intermetallic alloys, stripping can still cause interfacial disconnection, and films undergo significant structural changes due to volume changes during cycling, which can cause capacity decay by alloy agglomeration and pulverization. ,,, Li stripping from solid solution alloys is slightly different; Krauskopf et al demonstrated that stripping from the β-phase Li–Mg alloy mitigated interfacial contact loss in the absence of stack pressure. ,, Retained contact at the SSE interface during delithiation is beneficial in terms of homogenization of the stripping current distribution . However, the Li diffusion kinetics in the Li–Mg alloy was found to be a bottleneck that limited the stripping capacity. ,, …”