The Impact of Interface Characteristics on Mechanical Performance of a Hot-Forged Cu/Ti-Coated-Diamond Composite

Abstract

The Cu/55vol.%diamond (Ti) composites were fabricated by hot forging of the cold-pressed powder preforms, consisted of elemental copper powders and Ti-coated diamond particles, at 800 °C (800C-Cu/55Dia composite) and 1050 °C (1050C-Cu55Dia composite), respectively. Well bonded interface was achieved between the diamond and the copper matrix for the 800C-Cu/55Dia composite, and the coverage of diamond by interface was about 96%, attributed to homogeneously distributed nanospherical TiC interface formed on the diamond surface. However, obvious coarse TiC particle size and spallation of the formed interface were observed in the 1050C-Cu55Dia composite, implying that the composite had a relatively low bonding strength. The formed chemical bonding, good wettability and strong mechanical interlocking between the diamond and the copper matrix enable the 800C-Cu/55Dia composite having a high tensile strength of 145 MPa and a strain at fracture of 0.35%, which are about 260% and 170% higher than those of the 1050C-Cu55Dia composite, suggesting that the 800C-Cu/55Dia composite has the potential to have a high thermal conductivity and use as high-performance heat sink materials.

Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications

“…Copper-bassed diamond composite materials introduce significant internal stresses during hot forging, mainly limited between the interface and the copper matrix. The relatively fast cooling rate from forging temperature to room temperature can lead to interface detachment [67]. Suitable temperature and methods need to be found to control interface detachment between the interface and the matrix.…”