2018
DOI: 10.1149/2.0151804jes
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The Impact of Different Si Surface Terminations in the (001) n-Si/NiOx Heterojunction on the Oxygen Evolution Reaction (OER) by XPS and Electrochemical Methods

Abstract: The interaction between (001) n-Si and NiO x was investigated with regard to the oxygen evolution reaction (OER), applicable either for water splitting or CO 2 reduction. Thin layers of nickel oxide were deposited step by step by reactive sputter deposition and analyzed in-situ after each step using X-ray photoelectron spectroscopy (XPS). This was performed for silicon with different surface preparations: H-termination, thermally grown oxide (2 Å) and a monolayer of native oxide (4 Å). Upon contact formation t… Show more

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Cited by 14 publications
(20 citation statements)
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References 48 publications
(73 reference statements)
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“…Figure shows that the position of the Si 0 peak shifts to lower binding energy for any deposition method, indicating that the deposition of NiO leads to the formation of a depletion layer in the silicon with a built‐in voltage Vbi>0. The binding energies at the interfaces with RF and DC sputtered NiO saturate at ≈99.2 eV, corresponding to a built‐in potential of 0.4 V. This value is in line with what has been reported in the literature . In contrast, the binding energies obtained when NiO is deposited by MLO at T > 100 °C saturate at ≈99.0 eV, which is 0.6 eV lower than the expected value for the flat‐band condition.…”
Section: Resultssupporting
confidence: 88%
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“…Figure shows that the position of the Si 0 peak shifts to lower binding energy for any deposition method, indicating that the deposition of NiO leads to the formation of a depletion layer in the silicon with a built‐in voltage Vbi>0. The binding energies at the interfaces with RF and DC sputtered NiO saturate at ≈99.2 eV, corresponding to a built‐in potential of 0.4 V. This value is in line with what has been reported in the literature . In contrast, the binding energies obtained when NiO is deposited by MLO at T > 100 °C saturate at ≈99.0 eV, which is 0.6 eV lower than the expected value for the flat‐band condition.…”
Section: Resultssupporting
confidence: 88%
“…Recently, the interest in interfacing TMOs with silicon has substantially increased. Silicon/TMO structures can be encountered not only in water‐splitting devices where the TMO layer is a catalytic layer, but also in solid‐state junction where the TMO layer could be implemented for creating a charge‐selective contact. For instance, n‐type materials as TiO 2 and ZnO could be implemented to create electron‐selective contacts on silicon, whereas p‐type materials or high‐work‐function materials, such as MoO 3 , WO 3 , V 2 O 5 , and NiO, could be implemented to create hole‐selective contacts .…”
Section: Introductionmentioning
confidence: 99%
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“…It is seen that the sample produced at RT (Figure a) needs an additional line shape for adequate fitting, which contains higher oxidized Ni III of ∼13% . This is also reflected in the oxygen signal (Figure b), which shows two lattice-bound oxygen components, Ni II –O and Ni III –O, at 529.2 and 530.7 eV. , The oxygen component at higher binding energies (532.0 eV) was attributed to deficient, interstitial, and peroxo-like species, referred to as oxygen vacancy (O V ). The Ni 2p 3/2 region of NiO x prepared at 600 °C (Figure c) can be completely deconvoluted by the shape of the single crystal line, so the small amount of residual oxygen in Figure d is attributed to O V rather than Ni III moieties. The chemical composition in relation to the deposition temperature is summarized in Table S1.…”
Section: Resultsmentioning
confidence: 98%
“…S11 †), thereby conrming the highly defective nature of these materials. 31 Higher catalytic activities have previously been associated with highly defective and disordered phases of NiOOH. 32 Furthermore, the at band potential obtained from this analysis at 1.2 V RHE agrees well with previously literature reports.…”
Section: Resultsmentioning
confidence: 99%