The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method

Lin, T.Y.; Leong, Wei Sun; Chua, K.H.; Oh, Reum; Miao, Yuyang; Pan, Jisheng; Chai, J. W.

doi:10.1016/s0026-2714(02)00003-3

Cited by 13 publications

(4 citation statements)

References 4 publications

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“…For example, the Ag surface affects the wire bonding processability during the package assembly process; a poor Ag surface can result in a non-stick-on-lead (NSOL) quality and therefore a low yield during the wire bonding process. 2 When the die bonding pad has a Cu surface, the Cu surface affects the processability of the die attachment, such as the wetting of the epoxy and the epoxy bleeding out onto the Cu surface. Both the Ag and Cu surfaces also affect package reliability after stress tests due to their influence on the adhesion of mold compounds.…”

Section: Introductionmentioning

confidence: 99%

A Study of Plasma-Cleaned Ag-Plated Cu Leadframe Surfaces

2009

Journal of Elec Materi

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In this study, an Ar plasma was employed to remove the antitarnish layer on Ag-plated Cu leadframe surfaces using various process powers and times. Measurements of the contact angle, field-emission scanning electron microscopy, x-ray photoelectron spectroscopy, and time-of-flight secondary-ion mass spectrometry were employed to characterize both the Ag and Cu surfaces before and after plasma cleaning. The antitarnish layer on the leadframe surfaces was determined to be benzotriazole and/or its derivatives. Low-power and short-duration plasma treatments did not significantly change the Ag and Cu surfaces in terms of their surface morphologies, and such treatments were not able to totally remove the antitarnish layer. In contrast, a high-power and long-duration plasma treatment made the surfaces slightly smoother and was able to remove the antitarnish layer on both Ag and Cu surfaces. However, cross-contaminations were also detected between the Ag and Cu surfaces during the plasma cleaning process. This cross-contamination is due to redeposition of Ag and Cu atoms during the plasma treatment.

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Section: Introductionmentioning

confidence: 99%

A Study of Plasma-Cleaned Ag-Plated Cu Leadframe Surfaces

2009

Journal of Elec Materi

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“…Subsequently, wire pull test was carried out by employing a Dage series 4000 (Nordson dage) tester. The wire pull test conditions were 450 µm/s pulling speed and 1 gf test load [3].…”

Section: Methodsmentioning

confidence: 99%

A Study on Adhesive Properties of a Damascene Electroplated Cu Composite Sheet

Moon

Jung

Shin

2011

MSF

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In this paper, it was aimed to develop a new interconnect material having high electrical conductivity and strength simultaneously. The Cu composite sheet, possessing mesh type Ag conduction paths on the surface of a high strength Cu alloy sheet, was manufactured by damascene electroplating. The peel strength of Cu composite sheet prepared by damascene electroplating increased by above 50 times compared to Cu composite sheet by conventional electroplating. Al wire wedge bonding was able to be successfully conducted without extra metal thin film coating.

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“…The contamination was introduced not only by the manufacturing of material materials (such as passivation residual, photoresist residual, fluorine or CF polymers and diffused copper) but also by the assembly processes before wire bonding (such as silicon dust, oxide layer and solvent residual) (Prasad, 2004). These days there were many researches focusing on the effects on ball bonding (Chuang et al , 2006; Nowful and Lok, 2001; Park et al , 2007; Petzold et al , 2000) while few on the effects on stitch bonding (Lin et al , 2002).…”

Section: Introductionmentioning

confidence: 99%

Tin contamination in PQFN package and its effects on wire bondability

Zong¹,

Wang²,

Yang³

et al. 2013

Microelectronics International

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Purpose -The purpose of this paper was to attempt to confirm the root cause of unstable stitch pull strength in PQFN package and propose some permanent solutions for it. Design/methodology/approach -A screen experiment was designed to find the key process out of the manufacturing flow; a non-destructive detaching method and cross section polishing were used to inspect the bond integrity; Auger analysis assisted with argon ion sputter was tried to confirm the contamination; finally the manufacturing processes were redesigned to prevent the contamination. Findings -Some first aids of process optimization got little improvement; the screen experiment of processes found solder die bonding was the one resulted into a poor bond integrity which was demonstrated by non-destructive detaching method and cross section inspection; Auger analysis assisted with argon ion sputter detected that there was a tin layer thicker than 20 nm coated on the bonding surface and the wire bondability of gold wire on this tin coating was poor; the lead frame was redesigned to prevent the wetting and flowing of tin and got a perfect performance. Research limitations/implications -Because of the limitation of time and resources, the proposed solutions for this issue could be studied more deeply. Originality/value -This paper set up an example how to find out the root cause from the complex manufacturing process flow and put forward a quick solution accordingly for the issue.

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The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method

Cited by 13 publications

References 4 publications

A Study of Plasma-Cleaned Ag-Plated Cu Leadframe Surfaces

A Study of Plasma-Cleaned Ag-Plated Cu Leadframe Surfaces

A Study on Adhesive Properties of a Damascene Electroplated Cu Composite Sheet

Tin contamination in PQFN package and its effects on wire bondability

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