The IEEE EPS Packaging Benchmark Suite

Microwave/Millimeter-Wave Packaging for 5G and Beyond: Materials, Technologies, and Techniques [From the Guest Editors’ Desk]

“…Finally, as one would expect, there has been an increased interest in expanding the application space of recently developed machine learning and artificial intelligence optimization and design methods in this area, even though one can argue that this has been more of an opportunity than a challenge. One area that the EP-S is helping is to attract more researchers in industry and academia to concentrate on the challenging problems in packaging via a set of published packaging benchmark problems that are available publicly [6]. The MTT-S is working with the EP-S on the IEEE Heterogeneous Integration Roadmap technical working group on 5G RF-analog/mixed signal, producing the International Technology Roadmap for Semiconductors Roadmap (15/25 years strategic forecast of technology) [7].…”