Highly
conductive polymer foam with light weight, flexibility,
and high-performance electromagnetic interference (EMI) shielding
is highly desired in the fields of aerospace, communication, and high-power
electronic equipment, especially in the board-level packaging. However,
traditional technology for preparing conductive polymer foam such
as electroless plating and electroplating involves serious pollution,
a complex fabrication process, and high cost. It is urgent to develop
a facile method for the fabrication of highly conductive polymer foam.
Herein, we demonstrated a lightweight and flexible silver-wrapped
melamine foam (Ag@ME) via in situ sintering of metal–organic
decomposition (MOD) at a low temperature (200 °C) on the ME skeleton
modified with poly(ethylene imine). The Ag@ME with a continuous 3D
conductive network exhibits good compressibility, an excellent conductivity
of 158.4 S/m, and a remarkable EMI shielding effectiveness of 63 dB
in the broad frequency of 8.2–40 GHz covering X-, Ku-, K-,
and Ka-bands, while the volume content is only 2.03 vol %. The attenuation
mechanism of Ag@ME for EM waves is systematically investigated by
both EM simulation and experimental analysis. Moreover, the practical
EMI shielding application of Ag@ME in board-level packaging is demonstrated
and it shows outstanding near-field shielding performance. This novel
strategy for fabrication of highly conductive polymer foam with low
cost and non-pollution could potentially promote the practical applications
of Ag@ME in the field of EMI shielding.