The high-frequency characteristics of tape automated bonding (TAB) interconnects

Wentworth, Stuart M.; Neikirk, Dean P.; Brahce, C.R.

doi:10.1109/33.35480

Cited by 22 publications

(15 citation statements)

References 11 publications

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“…In our lab, Wentworth et al used the model to characterize tape automated bonding (TAB) interconnect in 1989 [3]. In 1996 Gevorgian et al [4] proposed a different model for an IDC with a multilayered top structure based on the same conformal mapping technique.…”

Section: A Confomral Mapping For Idcsmentioning

confidence: 98%

Measurement of liquid complex dielectric constants using non-contact sensors

et al. 2009

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Our primary objective in this work is the accurate measurement of complex dielectric constant and conductivity of unknown liquids. In this paper we present design, fabrication, and testing results for an IDC (interdigitated capacitor) electrode sensor for use as a fluid monitoring component that can be integrated into a microfluidic system. Unlike prior work we show how to accurately extract both the conductivity and permittivity of liquids, for loss tangents ranging from much less than one to greater than one (i.e., from lossy dielectrics to conductors); this has not been shown in previous work. In addition, we also demonstrate a method of remotely accessing the IDC sensor by wireless inductive coupling similar to EAS (Electronic Article Surveillance) tags.

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Section: A Confomral Mapping For Idcsmentioning

confidence: 98%

Measurement of liquid complex dielectric constants using non-contact sensors

et al. 2009

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“…A finite-element (FEM) program [7] found the capacitances of the waveguides using biquadratic elements that geometrically grew in size away from the conductor corners at a rate of 1.2 times the next closest element. The minimum element dimension was 0.1 m, and the capacitances found for the CPW lines agree to with in 4% of the conformal map predictions [8]. Volume filament method (VFM) [9] and surface ribbon method (SRM) [10] programs determined the frequency-dependent resistances and inductances and , respectively.…”

Section: Numerical Calculationsmentioning

confidence: 98%

The interdigital coplanar waveguide: a new low-impedance micromachinable planar structure

Thompson¹,

Rogers²

1998

IEEE Microw. Guid. Wave Lett.

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This letter describes a new type of coplanar waveguide (CPW) which we call interdigital coplanar waveguide (ICPW). ICPW has three advantages over CPW. First, ICPW can have a lower characteristic impedance for the same minimum feature size and overall line width. Second, at low impedances it can obtain reduced high-frequency resistive loss. Finally, thickening the conductor reduces the ohmic losses more rapidly in the ICPW than in the CPW. This letter presents an analysis comparing CPW and ICPW assuming a TEM mode of propagation. Calculations are performed using finite-element analysis, and volume filament and surface ribbon methods.

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“…The design of the line is based on the equations of the coplanar waveguides [7] taking into account the calculation of the characteristic impedance, the constraint rules of the design, and the geometry of RF measurement tips. The geometrical parameters of the transmission line are a length of 1400 lm, an interconnect line width of 71 lm, a pitch of 143 lm between two conductive lines.…”

Section: Electromagnetic Simulation Of Passive Componentsmentioning

confidence: 99%

“…This type of MMF normally has a bandwidth as low as 160 MHz.km at a wavelength of 0.85 lm [7]. There has been much work carried out on extending the usable bandwidth of MMF [7,8].…”

Section: Introductionmentioning

confidence: 99%

Improved test structure for on‐wafer microwave characterization of components

Descamps

Abessolo-Bidzo

Poirier³

2010

Micro & Optical Tech Letters

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Broadband design of non-symmetric ground k/4 open slot antenna with small size, Microwave J 50 (2007), 110-121. 9. A. Mehdipour, K. Mohammadpour-Aghdam, and R. Faraji-Dana, Complete dispersion analysis of Vivaldi antenna for ultra wideband application, Prog Electromagn Res 77 (2007), 85-96. ABSTRACT: This article presents the impact of different test structures on the results of microwave characterization of on-wafer components. In this study, we focus on the characterization and modeling of NXP Semiconductors Technology Passive Integration Connective Substrate (PICS) capacitor. First, we show the strong dependency of the extracted parameters according to test structure used when utilizing traditional open/short parasitic elements removing method. Second, we propose an optimization of the test structures to reduce their influence on the intrinsic parameters extracted from on-wafer characterization of the device under test. We also propose a way to improve the accuracy of the modeling of PICS devices in radiofrequency and microwave domains.ABSTRACT: This article presents non-return-to-zero (NRZ), binary phase-shift keying (BPSK) data transmission over 100 m (50-lm core) and 200 m (62.5-lm core) millimetre-wave multimode radio-over-fibre (RoF) links. The system consists of a 1.55-lm tunable laser source, a wide bandwidth 40-Gb/s Mach-Zehnder Modulator (MZM), and a highspeed photodiode for detection. Successful data transmission of 900 Mb/ s over 100 m and 500 Mb/s over 200-m multimode RoF links is achieved. A millimetre-wave carrier frequency of 38.8 GHz is used for the data transmission over multimode fibres which is believed to the highest reported so far. After the RoF links eye-diagrams are recovered with good Q-factor performance recorded. These measurements show that multimode fibre links have the potential for use in next generation in-building/campus wide pico-cellular and low cost distributed antenna systems.

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The high-frequency characteristics of tape automated bonding (TAB) interconnects

Cited by 22 publications

References 11 publications

Measurement of liquid complex dielectric constants using non-contact sensors

Measurement of liquid complex dielectric constants using non-contact sensors

The interdigital coplanar waveguide: a new low-impedance micromachinable planar structure

Improved test structure for on‐wafer microwave characterization of components

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