The High-Adhesion Die-Cleaning Tape with Dual-Functional Groups for Die to Wafer (D2W) Hybrid Bonding
Yu Zhang,
Ziqi Lian,
Fei Ding
et al.
Abstract:With the rapid development of artificial intelligence, high performance computing will break through Moore's law and move toward three-dimensional (3D) package integration of chips. Hybrid bonding has become a potential solution for advanced packaging, as the interconnect pitch shrinks to less than 1 μm. Die to wafer (D2W) hybrid bonding consists of chemical mechanical polishing (CMP), blading, plasma activation, prebonding, and annealing processes. The diced dies that are attached to tape will undergo several… Show more
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