The heat transfer characteristics of liquid cooling heat sink with micro pin fins

Chiu, Han-Chieh; Hsieh, Ren-Horn; Wang, Kai; Jang, Jer‐Huan; Yu, Cheng-Ru

doi:10.1016/j.icheatmasstransfer.2017.05.027

Cited by 101 publications

(19 citation statements)

References 22 publications

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“…The piranha pin fins were constructed to boost heat transfer by controlling the flow field, selectively venting the fluid, and enhancing the surface area. Chiu et al 100 studied the heat transfer characteristics of the liquid‐cooling heat sink with micropin fins (Figure 9). The results showed that effective thermal resistance reached an optimum value for different pressure drops.…”

Section: Experimental With Computational Combined Workmentioning

confidence: 99%

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Improvement of heat transfer through fins: A brief review of recent developments

Maji¹,

Choubey

2020

Heat Trans

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Fins or extended surfaces are generally used in heat exchangers to enhance heat transfer between the main surface and ambient fluid. Various types of simple-shaped fins, namely, rectangular, square, annular, cylindrical, and tapered, have been used with different geometrical combinations. To satisfy industrial demand, different trials have also been carried out for designing optimized fins. The optimization of fins can be performed either by enhancing heat dissipation at an exact fin weight or by diminishing the weight of the fin by precise heat dissipation. Recently a notable amount of work on some typical fins, like, porous fins and perforated fins, has also been carried out. This paper presents a brief review on heat transfer enhancement using fins of different types considering variable thermophysical and geometric parameters, which will also be useful for future use of geometrical modifications of extended surfaces, based on the cost and availability of space.analytical approach, computational approach, experimental approach, perforated fin, porous fin | INTRODUCTIONAdvanced technologies need high-performance heat transfer equipment. Techniques for enhancing the heat transfer rate are classified into two categories: active and passive methods. In the design point of view, active methods are complex as they require some extraneous power input for necessary flow adjustments and to improve the heat transfer rate and thus applications are limited. On the other hand, passive methods require geometrical or surface adjustments to the flow passage by incorporating additional devices. Additionally, by interrupting or varying the existing flow behavior (except for extended surfaces); higher heat transfer coefficients are promoted through this method, which is also followed by an increase in the corresponding pressure drop. The amount of conduction, convection, and radiation of an object shows the amount of heat it transfers. The heat transfer rate is enhanced by increasing the temperature difference between the object and the environment or by enhancing the coefficient of convective heat transfer or by maximizing the surface area of the body. In some cases, it is not appropriate or cost effective to alter the first two options. Introducing a fin to a body, however, expands the surface area and sometimes this is a cost-effective solution for heat transfer problems. Extended surfaces or fins are illustrations of passive methods that are generally used in different industrial applications for the enhancement of heat transfer between the primary surface (heat sink) and the surrounding fluid. Currently reducing the cost and size of fins is the key target of the fin industry. This demand is generally met by the high-thermal-conductivity and costly metals used to fabricate finned surfaces. Many efforts have been made to construct optimized fins. (a) By changing the size and shape of the solid fin: Instead of a longitudinal rectangular solid fin, if the geometry of fin design is changed, the performance parameters and heat tr...

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Section: Experimental With Computational Combined Workmentioning

confidence: 99%

“…Pin fin of different geometry and their temperature contours 100 [Color figure can be viewed at wileyonlinelibrary.com]…”

Section: Experimental With Computational Combined Workmentioning

confidence: 99%

Improvement of heat transfer through fins: A brief review of recent developments

Maji¹,

Choubey

2020

Heat Trans

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“…http://jurnal.untirta.ac.id/index.php /vanos ISSN 2528-2611, e-ISSN 2528-2700Vol.2, No.2, December 2017, Page.97-104. Vol.2, No.2, December 2017ISSN 2528-2611, e-ISSN 2528-2700 between the pivot range of 0.5 and 0.6 (Chiu, et al, 2017). Based on research that has been done by the researchers before, came the thought to do the efficiency of cooling on the heat sink.…”

Section: Vanos Journal Of Mechanical Engineering Educationmentioning

confidence: 99%

Numerical Cooling Simulation on Laptop Heat Sinks With Variations of Different Airflow Speeds

Syamsuri

Riani

2017

VANOS JMEE

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Cooling on electronic objects, especially laptop is something to note. If the cooling system is not good, there will be overheating on the main chip motherboard and other components so that the laptop will be damaged quickly. This research aims to determine the temperature distribution on the heat sink laptop so that overheat can be overcome. This research was carried out numerically, where the specimen was a heat sink component on a laptop unit simulated using Solid works 2011 software in three dimensions with variations carried out in the form of air velocity values passing through the specimens of 5, 10, and 15 m/s. The results obtained in this study showed that the higher the speed of air flow through the heat sink, the higher the transfer of heat transfer.

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“…The wetting velocities of titanium pillars coated with nanostructured titania was found to increase by as much as 160% compared to uncoated titanium pillars. Chiua et al [14] examined larger micropillars with a height of 500 μm and reported an increase in the thermal resistance of the micropillar array as the spacing between the micropillars increased. Ranjan et al [15][16][17] analyzed the use of CNT nanostructures to enhance the capillary transport performance of nanostructured wicks in heat-spreading applications.…”

Section: Introductionmentioning

confidence: 99%

Fabrication and Thermal Characterization of Composite Cu-CNT Micropillars for Capillary-driven Phase-Change Cooling Devices

Rojo

Ghanbari

Darabi

2019

Nanoscale and Microscale Thermophysical Engineering

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This paper presents the fabrication, testing, and modeling of an array of composite copper-carbon nanotubes (Cu-CNT) micropillars as a wick structure for potential application in passive phasechange cooling systems. This novel wick structure has a larger spacing at the base of the micropillars to provide a higher liquid permeability and mushroom-like structures on the top surface of the micropillars with a smaller spacing to provide a greater capillary pressure. The composite Cu-CNT micropillars were fabricated by an electrochemical deposition method on a patterned copper template. Cauliflower-like nanostructures were then grown on the top surface of the micropillars using chronoamperometry technique to improve the capillary pressure and thermal performance of the wick structure. After successful fabrication of the micropillars, a series of tests were conducted to quantify the thermal performance of the wick structures. The results demonstrate superior thermal and corrosion performances for composite Cu-CNT micropillars compared to those of copper micropillars. Additionally, a thermal resistance network analysis was conducted to model the thermal performance of the fabricated mushroom-shaped micropillar array. Model predictions were compared with the experimental results and good agreement was observed.

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The heat transfer characteristics of liquid cooling heat sink with micro pin fins

Cited by 101 publications

References 22 publications

Improvement of heat transfer through fins: A brief review of recent developments

Improvement of heat transfer through fins: A brief review of recent developments

Numerical Cooling Simulation on Laptop Heat Sinks With Variations of Different Airflow Speeds

Fabrication and Thermal Characterization of Composite Cu-CNT Micropillars for Capillary-driven Phase-Change Cooling Devices

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