The heat transfer and fluid flow of a partially heated microchannel heat sink

Lelea, Dorin

doi:10.1016/j.icheatmasstransfer.2009.05.003

Cited by 23 publications

(14 citation statements)

References 9 publications

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“…The main reason why the conclusions from the previous studies did not apply to the situation examined in this study was that the previous study was focused on heat sinks under turbulent flows with very high flow rates and the present experiments were conducted for heat sinks under laminar developing flows. The fact that Lelea also observed that upstream heating had a better thermal performance than central or downstream heating for the heat sink under laminar flow in his study [19] supported this reasoning, although his study was focused on water-cooled microchannel heat sinks. The heat sinks used in the practical situations showed heat losses through the front, back, and sides of the heat sink (q loss,f , q loss,b , and q loss,s in Figure 1).…”

Section: Figure 4amentioning

confidence: 84%

“…Yoon et al also experimentally investigated the thermal performance of plate-fin and strip-fin minichannel heat sinks, under partial heating [18]. Lelea analyzed the effects of the heating position on the thermal performance of a microchannel heat sink by numerically solving the conjugate heat transfer problem [19]. He observed that the heating position influences the thermal characteristics and that upstream heating has a better thermal performance than central or downstream heating.…”

Section: Introductionmentioning

confidence: 99%

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Experimental Study on Forced Convection Heat Transfer from Plate-Fin Heat Sinks with Partial Heating

Lee

Kim

2019

Processes

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In this study, plate-fin heat sinks with partial heating under forced convection were experimentally investigated. The base temperature profiles of the plate-fin heat sinks were measured for various heating lengths, heating positions, flow rates, and channel widths. From the experimental data, the effects of heating length, heating position, and flow rate on the base temperature profile and the thermal performance were investigated. Finally, the characteristics of the optimal heating position were investigated. As a result, it was shown that the optimal heating position was on the upstream side in the case of the heat sinks under laminar developing flow, as opposed to the heat sinks under turbulent flow. It was also shown that the optimal heating position could change significantly due to heat losses through the front and back of the heat sink, while the effects of the heat loss through the sides of the heat sink on the optimal heating position were negligible. In addition, it was shown that the one-dimensional numerical model with empirical coefficients could predict the important trends in the measured temperature profiles, thermal resistances, and optimal heating lengths.

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Section: Figure 4amentioning

confidence: 84%

Section: Introductionmentioning

confidence: 99%

Experimental Study on Forced Convection Heat Transfer from Plate-Fin Heat Sinks with Partial Heating

Lee

Kim

2019

Processes

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“…Their observation was based on numerical analysis on three microtube wall materials (made of steel, silicon, and copper, respectively). Later on Lelea [31] considered partially heated (constant heat flux at the bottom of the substrate) rectangular microchannel array on a flat substrate for their numerical study and found that upstream heating has a lower thermal resistance compared to central or downstream heating. Explicit effects of substrate thickness or substrate conductivity were not reported in this study.…”

Section: Axial Wall Conduction In Partially Heated Microtubesmentioning

confidence: 99%

Axial Back Conduction through Channel Walls During Internal Convective Microchannel Flows

Khandekar

Moharana

2015

Springer Tracts in Mechanical Engineering

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Recent developments during the last decade in the field of manufacturing and development of many high-power mini-/micro-devices led to increased interest in microfluidic devices involving heat transfer. Since the pioneering work by Tuckerman and Pease (IEEE Electron Device Lett 2:126-129, 1981) on the use of microchannels for high heat flux removal, certainly a lot of developments has been witnessed through ever-increasing analytical, experimental, and highly sophisticated numerical studies by many researchers across the globe. In spite of this progress, many fundamental understandings of flow and heat transfer phenomena in mini-/microchannel systems are still obscure. One such phenomenon is the flow of heat in the solid wall of microchannel systems by means of conduction normally in a direction opposite to that of internal convective mini-/microchannel flow of fluid, called "axial wall conduction" or "axial back conduction." Axial back conduction is not a new phenomenon, rather mostly neglected unintentionally because of its convincingly smaller influence on heat transfer in conventional-size channels. As the hydraulic diameter of a channel decreases, the coupling between the substrate and bulk fluid temperatures becomes significant because of the relative size of the fluid to the solid wall. Unlike in conventional-size channels, negligence of axial back conduction along the solid walls of micro heat exchangers frequently leads to erroneous conclusions and inconsistencies in the interpretation of transport data. Thus, it is important to explicitly identify the thermofluidic parameters of interest which lead to a distortion in the boundary conditions and thus the true estimation of species transfer coefficients. In this chapter, we focus our attention on the axial back conduction in the solid substrate/channel wall as against the axial back conduction in the liquid flow domain; thus, a detailed review of the state-of-the-art on axial back conduction in both conventional as well as mini-/microchannel systems is presented.

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“…Although a number of numerical [8,[10][11][12][13][14][15] as well as experimental studies [8,10,[16][17][18][19] have been performed, an explicit parameter for discerning the effect of axial conduction on the heat transport coefficient in microchannel flows, under a given set of geometry and boundary conditions, is still not available. Secondly, most of the studies deal with circular micro tubes.…”

Section: Literature Reviewmentioning

confidence: 99%

Axial Heat Conduction in the Context of Developing Flows in Microchannels

Moharana

Singh

Khandekar

2011

ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, Volume 1

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For practical microchannel applications involving convective heat transfer, the flows are usually, not only laminar, they are also simultaneously developing in nature. Moreover, flat plate substrates with microchannels engraved/ machined or etched on them are emerging as one of the most popular flow geometries. Not analyzing such situations as conjugate heat transfer problems with multi-dimensional effects, often leads to erroneous estimation of heat transfer coefficients. In this context, we report three dimensional numerical simulations of simultaneously developing internal convective flow through a square microchannel (side = 400 μm), treating the substrate thickness, flow Reynolds number and the thermal conductivity of the substrate and the fluid, in the conjugate formulation. Constant heat flux is applied at the bottom of the substrate, away from the fluid-solid interface, as in real-time situations. The parametric study reveals that depending on geometry considerations, flow parameters and thermo-physical properties of fluid-solid combination, conjugate heat transfer effects must be accounted for, to correctly estimate the local Nusselt number.

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The heat transfer and fluid flow of a partially heated microchannel heat sink

Cited by 23 publications

References 9 publications

Experimental Study on Forced Convection Heat Transfer from Plate-Fin Heat Sinks with Partial Heating

Experimental Study on Forced Convection Heat Transfer from Plate-Fin Heat Sinks with Partial Heating

Axial Back Conduction through Channel Walls During Internal Convective Microchannel Flows

Axial Heat Conduction in the Context of Developing Flows in Microchannels

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