The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows

Li, Shuang; Du, Yao; Q, Lin; Kunwar, Anil; Sun, Junhao; Liu, Jiahui; Zhao, Ning; Huang, Mingliang; Ma, Hongan

doi:10.1109/isaf.2014.6918010

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M 2014

DOI: 10.1109/isaf.2014.6918010

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The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows

Shuang Li¹,

Yao Du²,

Lin Q³

et al.

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The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows

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