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2020
DOI: 10.1038/s41928-020-00492-7
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The future of ferroelectric field-effect transistor technology

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Cited by 511 publications
(366 citation statements)
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References 67 publications
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“…[8][9][10][11][12][13][14][15] Ferroelectric materials, in particular, perovskites ferroelectrics [8] such as Pb(Zr,Ti)O 3 (PZT), [16][17][18] BaTiO 3 , [19][20][21] and SrBi 2 Ta 2 O 9 [22,23] have been widely studied. However, due to integration challenges with modern complementary metal oxide semiconductor (CMOS) technologyetching, hydrogen sensitivity, thickness, and scaling beyond the 130 nm technology node, [24] industrial applications of perovskite oxides have never been materialized.…”
Section: Introductionmentioning
confidence: 99%
“…[8][9][10][11][12][13][14][15] Ferroelectric materials, in particular, perovskites ferroelectrics [8] such as Pb(Zr,Ti)O 3 (PZT), [16][17][18] BaTiO 3 , [19][20][21] and SrBi 2 Ta 2 O 9 [22,23] have been widely studied. However, due to integration challenges with modern complementary metal oxide semiconductor (CMOS) technologyetching, hydrogen sensitivity, thickness, and scaling beyond the 130 nm technology node, [24] industrial applications of perovskite oxides have never been materialized.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, FeFET and FTJ could provide large dynamic ranges (G On /G Off ≀ 10 2 ) with numerous intermediate states. Hence, multi-level spintronic devices can be well suited for implementing frequently updated components such as neurons, while ferroelectric devices are considered to be more suitable for implementing analog synapses, given the device characteristics of large memory windows between states, low read/write energy, fast switching, and superior CMOS compatibility (Khan et al, 2020 ). In the following, we will elaborate particular challenges of implementing crossbar in-memory computing based on ReRAM and PCM materials, and highlight the strength in spintronic and ferroelectric device characteristics that could potentially address some of the challenges.…”
Section: Discussionmentioning
confidence: 99%
“…[4][5][6][7] Ferroelectric field-effect transistor (FeFET) containing a ferroelectric thin film within the gate stack has received extensive interest for the next-generation nonvolatile memory applications, featuring low power consumption, fast write/read speed, and simple structure. [8][9][10] In principle, the memory state or channel conductance is modulated by the polarization of ferroelectric thin film in FeFET, which can be retained after removing gate voltage (i.e., nonvolatility). Multiple nonvolatile memory states could be readily achieved in the FeFETs with multi-domain ferroelectric thin films possessing multipolarization states.…”
mentioning
confidence: 99%
“…Multiple nonvolatile memory states could be readily achieved in the FeFETs with multi-domain ferroelectric thin films possessing multipolarization states. [10,11] Indeed, the capability of multilevel programming has been widely reported in the FeFETs gated with Pb(Zr,Ti)O 3 , SrBi 2 Ta 2 O 9 , and PVDF-TrFE ferroelectric thin films, demonstrating attractive potential in the abovementioned multilevel memory and neuromorphic applications. [12][13][14][15] However, because of the poor compatibility with…”
mentioning
confidence: 99%