The front-end hybrid for the ATLAS HL-LHC silicon strip tracker

Mahboubi, K.; Greenall, A.; Allport, P. P.; Affolder, A. A.; Wormald, M.; Smith, Andy; Carroll, John L.; Wonsak, S.; Llácer, Carlos Lacasta; Bernabéu, J.; Marco-Hernandez, Ricardo; García, C.; Munoz, D S; Gregor, I. M.; Stanitzki, M. M.; Ariza, D.; Bloch, I.; Friedric, C; Poley, L.; Rehnisch, L.; Mori, R.; Kuehn, S.; Jakobs, K.; Parzefall, U.

doi:10.1088/1748-0221/9/02/c02027

Cited by 11 publications

(15 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The hybrid(s) and powerboard are glued directly on top of the sensor to create a module. Hybrids contain a number of front-end ASICs, the ATLAS Binary Chips or ABCstars, as well as one Hybrid Control Chip, or HCCstar [4]. These are described further in the next section.…”

Section: Sensors and Modulesmentioning

confidence: 99%

The ATLAS ITk strip detector system for the High Luminosity LHC upgrade

Keller

2020

Nuclear Instruments and Methods in Physics Research Section A:

View full text Add to dashboard Cite

A B S T R A C TThe ATLAS experiment at the Large Hadron Collider is currently preparing major detector upgrades to meet the requirements of the High Luminosity LHC (HL-LHC), scheduled to begin in 2026. With the radiation damage and high density of tracks expected at the HL-LHC, the current Inner Detector would be inoperable, and will instead be replaced by an all-silicon Inner Tracker (ITk). The ITk consists of two sub-systems: a pixel detector close to the beam pipe, and a strip detector at larger radii. This paper presents results from an extensive design and prototyping effort for the ITk strip detector, including studies of the sensors, electronics, and support structures. The performance of the detector has been validated through testbeams, simulations, and thermal and electrical prototypes. Plans for the forthcoming production phase are also presented.

show abstract

Section: Sensors and Modulesmentioning

confidence: 99%

The ATLAS ITk strip detector system for the High Luminosity LHC upgrade

Keller

2020

Nuclear Instruments and Methods in Physics Research Section A:

View full text Add to dashboard Cite

show abstract

“…The devices investigated in the testbeam were constructed as similarly as possible to the required future strip tracker modules, given current availability of components [7]. Each module consisted of a prototype of an actual silicon micro strip sensor, onto which a hybrid with front-end readout chips was glued [8]. Aluminium wedge wire bonding was used both to connect the sensor strips and ASIC readout channels and to connect the ASICs and hybrid electrically.…”

Section: Devicesmentioning

confidence: 99%

Characterisation of strip silicon detectors for the ATLAS Phase-II Upgrade with a micro-focused X-ray beam

et al. 2016

View full text Add to dashboard Cite

The planned HL-LHC (High Luminosity LHC) in 2025 is being designed to maximise the physics potential through a sizable increase in the luminosity up to 6 · 10 34 cm −2 s −1 . A consequence of this increased luminosity is the expected radiation damage at 3000 fb −1 after ten years of operation, requiring the tracking detectors to withstand fluences to over 1 · 10 16 1 MeV neq/cm 2 . In order to cope with the consequent increased readout rates, a complete re-design of the current ATLAS Inner Detector (ID) is being developed as the Inner Tracker (ITk).Two proposed detectors for the ATLAS strip tracker region of the ITk were characterized at the Diamond Light Source with a 3 µm FWHM 15 keV micro focused X-ray beam. The devices under test were a 320 µm thick silicon stereo (Barrel) ATLAS12 strip mini sensor wire bonded to a 130 nm CMOS binary readout chip (ABC130) and a 320 µm thick full size radial (end-cap) strip sensor -utilizing bi-metal readout layers -wire bonded to 250 nm CMOS binary readout chips (ABCN-25).A resolution better than the inter strip pitch of the 74.5 µm strips was achieved for both detectors. The effect of the p-stop diffusion layers between strips was investigated in detail for the wire bond pad regions.Inter strip charge collection measurements indicate that the effective width of the strip on the silicon sensors is determined by p-stop regions between the strips rather than the strip pitch.

show abstract

“…The prototype chips are named ABC130 and HCC130, whereas the production chips are named ABCStar and HCCStar. Prior prototypes were developed using chips produced in a 250 nm CMOS process [4].…”

Section: Introductionmentioning

confidence: 99%