The fracture performance of adhesively bonded orthodontic brackets: an experimental-FE modelling study

Yan, Chengcheng; L., J.; Zhang, Y. X.; Wu, Chengwei; Yang, Peng; Wang, P.; Zhang, W.; Han, Xiao

doi:10.1080/00218464.2020.1826320

Cited by 6 publications

(4 citation statements)

References 35 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…During loading, the deformation was recorded through a high‐resolution camera (JHSM500f, Jinghang Technology, China). Digital image correlation (DIC) was utilized to obtain the full‐field strain 43 . The tensile modulus and strength of specimens were then calculated.…”

Section: Methodsmentioning

confidence: 99%

See 1 more Smart Citation

Curing kinetics and mechanical properties of magnetocured epoxy adhesive doped with magnetic nanoparticles

Zhang,

Wu,

Zhang

et al. 2023

Polymer Composites

Self Cite

View full text Add to dashboard Cite

The curing kinetics as well as the corresponding tensile properties of magnetocured epoxy adhesive doped with magnetic nanoparticles (MNPs) is investigated in this article, where the curing reaction process is depicted using an isoconversional model. It is found that the tensile modulus and strength strongly depend on the curing degree (CD) and mass fraction of MNPs when curing degree varies from 0.7 to 1.0. When curing degree is 0.7, the tensile modulus of the adhesive with 15%wt and 30%wt MNPs increases by 46% and 592% compared to that with 10%wt MNPs, respectively, but the increase is not obvious when curing degree is higher than 0.9. This difference is more significant in the tested tensile strength, where the samples with 15%wt and 30%wt MNPs are 7.08 and 20.83 times higher than the one with 10%wt MNPs under 0.7 curing degree. However, the corresponding tensile strength with 1.0 curing degree is reduced by 4% and 35%, respectively. Scanning electron microscopy observation reveals different fracture mechanisms caused by curing degree variation. Failure occurs in the adhesive region for curing degree below 0.9, while failure initiates and propagates at the interface between adhesive and MNPs for curing degree above 0.9. It can be concluded that the intrinsic property of the adhesive determines the tensile properties when the curing degree is lower than 0.9, while the weak interfacial interaction between adhesive and MNPs introduces reverse effect when the curing degree is higher than 0.9. This competitive relationship should be considered in the design of magnetocuring process.Highlights Enhancement in adhesive modulus from MNPs addition degrades as CD approaches 1. Intrinsic property of adhesive determines the tensile strength with CD < 0.9. Weak interface dominates the failure mechanism in adhesive with CD > 0.9.

show abstract

Section: Methodsmentioning

confidence: 99%

“…Digital image correlation (DIC) was utilized to obtain the full-field strain. 43 The tensile modulus and strength of specimens were then calculated. A total of 30 specimens with curing degree varying from 0.7 to 1.0 were tested for each kind of MNPs concentration.…”

Section: Quasi-static Tensile Testmentioning

confidence: 99%

Curing kinetics and mechanical properties of magnetocured epoxy adhesive doped with magnetic nanoparticles

Zhang,

Wu,

Zhang

et al. 2023

Polymer Composites

Self Cite

View full text Add to dashboard Cite

show abstract

“…The elastic modulus of the adhesive film is closely related to the curing pressure and temperature. Based on recommendations from the supplier and various studies in the literature, the elastic modulus of METLBOND ® 1515-4M was determined to be 3.5 GPa [64][65][66]. The yield strength, ultimate strength and strain at failure of the adhesive were not available in the data sheet and, since they are not essential to the purposes of the work and the manufacturing of a tensile test specimen out of a film adhesive is not straightforward, they were not evaluated.…”

Section: Adhesivementioning

confidence: 99%

Evaluation of XD 10 Polyamide Electrospun Nanofibers to Improve Mode I Fracture Toughness for Epoxy Adhesive Film Bonded Joints

2023

View full text Add to dashboard Cite

The demand for ever-lighter structures raises the interest in bonding as a joining method, especially for materials that are difficult to join with traditional welding and bolting techniques. Structural adhesives, however, are susceptible to defects, but can be toughened in several ways: by changing their chemical composition or by adding fillers, even of nanometric size. Nanomaterials have a high surface area and limited structural defects, which can enhance the mechanical properties of adhesives depending on their nature, quantity, size, and interfacial adhesion. This work analyzes the Mode I fracture toughness of joints bonded with METLBOND® 1515-4M epoxy film and XantuLayr electrospun XD 10 polyamide nanofibers. Two joint configurations were studied, which differed according to the position of the nanomat within the adhesive layer: one had the nanofibers at the substrate/adhesive interfaces, and the other had the nanofibers in the center of the adhesive layer. Double cantilever beam joints were manufactured to evaluate the Mode I fracture toughness of the bonding with and without nano-reinforcement. The nanofibers applied at the substrate/adhesive interface improved the Mode-I fracture toughness by 32%, reaching the value of 0.55 N/mm. SEM images confirm the positive contribution of the nanofibers, which appear stretched and pulled out from the matrix. No fracture toughness variation was detected in the joints with the nanofibers placed in the middle of the adhesive layer.

show abstract

“…to represent the joint using a cohesive zone model (CZM) [2][3][4]. The CZM approach has bee used in analysis for fields as varied as dental implants [5], flexible piping structures for the oil sector [6], and bonding of dissimilar metals for advanced body-in-white design applications [37]. An interface or thin layer where a crack may initiate and propagate can be modeled using CZM elements, without the need for a predefined defect in the bond line [8], defined using a tractionseparation response [9].…”

mentioning

confidence: 99%

A novel cohesive zone modelling approach to represent mixed mode loading and bond line thickness effects

Watson

Worswick

Cronin

2023

The Journal of Adhesion

View full text Add to dashboard Cite

Accurate representation of the traction-separation response for mixed mode loading in a cohesive zone model (CZM) is critical to predicting the response of adhesive joints in a number of applications, including transportation and vehicle crashworthiness. Traditionally, the Mode I and Mode II responses are treated independently, with mixed mode response determined by relationships between the degree of mode mixity and separation, potentially leading to overprediction of the plateau traction and underprediction of the plateau length in mixed mode loading. This poor fit is due to the indirect relationship between mixity and traction and having minimal fitting options for separation-to-plateau and softening. To address this limitation, a mixed mode CZM approach is proposed, based on measured mixedmode traction-separation results for a toughened epoxy adhesive. The effects of bond line thickness were considered, to examine the ability of the proposed approach to include additional effects (beyond mode mixity) that are known to affect the traction-separation response. The CZM implementation was assessed using the original test data and was shown to capture the measured experimental traction-separation response across a range of mixed mode loading and bond line thickness more accurately compared to traditional CZM treatments.

show abstract

The fracture performance of adhesively bonded orthodontic brackets: an experimental-FE modelling study

Cited by 6 publications

References 35 publications

Curing kinetics and mechanical properties of magnetocured epoxy adhesive doped with magnetic nanoparticles

Curing kinetics and mechanical properties of magnetocured epoxy adhesive doped with magnetic nanoparticles

Evaluation of XD 10 Polyamide Electrospun Nanofibers to Improve Mode I Fracture Toughness for Epoxy Adhesive Film Bonded Joints

A novel cohesive zone modelling approach to represent mixed mode loading and bond line thickness effects

Contact Info

Product

Resources

About