Silicon Carbide - Materials, Processing and Applications in Electronic Devices 2011
DOI: 10.5772/22256
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The Formation of Silicon Carbide in the SiCx Layers (x = 0.03–1.4) Formed by Multiple Implantation of C Ions in Si

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Cited by 2 publications
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“…In general, it is seen that the films № 1 and № 2 have a similar structure with a distinct fragmentation of the grains on the surface and different from films № 3 and № 4 having insufficient grain fragmentation. This may be due to excessive content of carbon atoms [9,10] in the films № 3 and 4 due to the higher synthesis temperature and a high pressure of CO gas. …”
Section: Resultsmentioning
confidence: 99%
“…In general, it is seen that the films № 1 and № 2 have a similar structure with a distinct fragmentation of the grains on the surface and different from films № 3 and № 4 having insufficient grain fragmentation. This may be due to excessive content of carbon atoms [9,10] in the films № 3 and 4 due to the higher synthesis temperature and a high pressure of CO gas. …”
Section: Resultsmentioning
confidence: 99%