Abstract:A thermal-mechanical coupled finite element analysis model of solder joints is established, which plays a role in mechanical support and electrical connection in flip chip. Periodic temperature cycle load (-45 ~125 ) applied on the solder joints and it will generate periodic internal stress and strain in the process of the temperature cycling. With repeat using, the solder joints will produce deformation, and then cracks, extension, interlayer delaminating. The failure of the solder joints may cause the failur… Show more
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