The Feasibility of Numerical Calculations of Vias Using the Matrix-Penciled Moment Method

Li, Hailiang; Tian, Yu; Tong, Ling

doi:10.2529/piers090903222343

Cited by 1 publication

(2 citation statements)

References 7 publications

(5 reference statements)

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“…When computing for the circuit of the microstrip line, the RWG–DCI–PEEC method should be used, and Green's function

G (\overset{⇀}{r}, {\overset{r}{true}}^{'})

is computed by the DCI method. When computing for the circuit of the hole, the matrices of the inductance and coefficient of potential are obtained by a simplified method using the free‐space Green's function

G (\overset{⇀}{r}, {\overset{r}{true}}^{'})

such as in , in which effective permittivity is used. After the equivalent circuits are obtained, the modified nodal analysis (MNA) method is used for the node‐voltage, branch‐current, and S parameters.…”

Section: Modeling Methods Derivationmentioning

confidence: 99%

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Circuit model and signal integrity analysis for multilayer printed circuit board interconnection

Kong

Sheng

et al. 2013

Int J RF and Microwave Comp Aid Eng

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A circuit modeling method and signal integrity analysis approach for multilayer printed circuit board interconnection based on the partial equivalent element circuit (PEEC) method is proposed. The multilayer interconnection structure is divided into a via hole and microstrip lines. A three-dimensional (3D) model of a via hole structure is constructed using the PEEC method with Rao-Wilton-Glisson (RWG) basis functions. The microstrip lines on the top and bottom layers are modeled by PEEC method with RWG basis functions and discrete complex image. The model order reduction method is used to analyze effectively the via hole structure. The equivalent circuit of the via hole structure is simplified, and its physical meaning is defined. The scattering (S) parameter obtained from the proposed method is consistent with simulation results, which are computed using the commercial 3D electromagnetic field analysis software FEKO. The correctness of the proposed method is validated. The S parameters of different dimensions are simulated, and the effects of these dimensions on the electromagnetic characteristics of the via hole structure are analyzed. The model of the entire structure is used to conduct eye diagram simulation.

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“…When computing for the circuit of the microstrip line, the RWG–DCI–PEEC method should be used, and Green's function

G (\overset{⇀}{r}, {\overset{r}{true}}^{'})

G (\overset{⇀}{r}, {\overset{r}{true}}^{'})

Section: Modeling Methods Derivationmentioning

confidence: 99%

“…In Refs. to , a through‐hole in the ground plane is modeled and analyzed using the matrix pencil moment method, which is a MOM. In Ref.…”

Section: Introductionmentioning

confidence: 99%

Circuit model and signal integrity analysis for multilayer printed circuit board interconnection

Kong

Sheng

et al. 2013

Int J RF and Microwave Comp Aid Eng

View full text Add to dashboard Cite

show abstract

The Feasibility of Numerical Calculations of Vias Using the Matrix-Penciled Moment Method

Cited by 1 publication

References 7 publications

Circuit model and signal integrity analysis for multilayer printed circuit board interconnection

Circuit model and signal integrity analysis for multilayer printed circuit board interconnection

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