2012
DOI: 10.1088/1748-0221/7/02/c02050
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The FE-I4 pixel readout system-on-chip resubmission for the insertable B-Layer project

Abstract: The FE-I4 is a new pixel readout integrated circuit designed to meet the requirements of ATLAS experiment upgrades. The first samples of the FE-I4 engineering run (called FE-I4A) delivered promising results in terms of the requested performances. The FE-I4 team envisaged a number of modifications and fine-tuning before the actual exploitation, planned within the Insertable B-Layer (IBL) of ATLAS. As the IBL schedule was pushed significantly forward, a quick and efficient plan had to be devised for the FE-I4 re… Show more

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Cited by 22 publications
(16 citation statements)
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“…The FE-I4A was not intended for the final detector and the pixel matrix was non-uniform to allow performance comparisons between various analog circuit design choices. The FE-I4B chip was first fabricated in 2011 [33,34] and tailored to fully meet the IBL requirements. In addition to selecting the analog design and making the pixel matrix uniform, specific powering choices were made and data acquisition features added.…”
Section: The Fe-i4 Front-end Chipmentioning
confidence: 99%
“…The FE-I4A was not intended for the final detector and the pixel matrix was non-uniform to allow performance comparisons between various analog circuit design choices. The FE-I4B chip was first fabricated in 2011 [33,34] and tailored to fully meet the IBL requirements. In addition to selecting the analog design and making the pixel matrix uniform, specific powering choices were made and data acquisition features added.…”
Section: The Fe-i4 Front-end Chipmentioning
confidence: 99%
“…The Yet Another Rapid Readout (YARR) [4] system provides simple and powerful DAQ for both current generation pixel readout chips, such as FE-I4 [5], and next generation pixel readout chips, such as RD53A. Commands are sent to, and data is read from, the pixel readout chips via a…”
Section: Yet Another Rapid Readoutmentioning
confidence: 99%
“…This 3D pixel sensor and the readout ASIC [17] were originally designed for the Insertable B Layer [18] currently being installed at the ATLAS [19] experiment at CERN, optimised for looking at high energy particles from events occurring every 25 ns. In addition to permitting studies of the beam profile, this technology offered interesting features relevant for our application as described below.…”
Section: B Second Measurements With 3d Pixel Sensormentioning
confidence: 99%