“…These results occurred due to plastic behavior of paste. Increasing substrate speed causes an increase in shear stress on paste filament which results in lower pattern width [35]. The plot further illustrates that influence of gap size on pattern width is insignificant as the line not sharper.…”
Section: Main Effect On Pattern Width and Analysis Of Variancementioning
confidence: 85%
“…From the plot, it is also evident that the mean width increases with increase in pressure. It is due to the higher viscosity of paste and increased discharge rate at high pressure [35]. Moreover, the decreasing trend for substrate speed in the plot shows that pattern width decreases with increase in substrate speed.…”
Section: Main Effect On Pattern Width and Analysis Of Variancementioning
confidence: 92%
“…Printing input parameters selected for the study are pressure, substrate speed and gap size (distance between nozzle tip and surface of the substrate), while output (response variable) is pattern width. Input parameters are selected based on previous studies [10,11,27,28,34,35]. Determining the optimal parameter is one of the challenging tasks, which is beneficial for the industry.…”
Section: Printing Parameters and Design Of Experimentsmentioning
The present work discusses the fabrication of low-cost, reliable and durable flexible electronic circuits from conductive carbon paste on flexible polyethylene terephthalate (PET) substrate using microdispensing direct ink write technique. Printing parameters such as pressure, substrate speed and gap size are optimized through Box-Behnken experimental design technique to achieve the desired quality of prints (patterns). For the nozzle with an inner diameter of 200 µm, the system is able to produce pattern line width ranging from 198 µm to 295 µm, respectively. Based on optimized parameters, circuits such as foil grid and rectangular spiral are printed on a flexible PET substrate. The deposited patterns of circuits are morphologically characterized by optical microscopy and scanning electronic microscopy. Current-Voltage (I-V) characteristic is performed to evaluate the conductive performance of circuits. The sensitivity of circuits to bending is assessed by studying resistance response under fully bend and unbend angle of 90° and 0°. Durability and reliability of circuits are analyzed by subjecting circuits to continuous 500 bend cycles and study its resistance response. The analysis revealed that these direct ink write circuits are reliable, durable and stable in performance and are applicable to the flexible electronic application.
“…These results occurred due to plastic behavior of paste. Increasing substrate speed causes an increase in shear stress on paste filament which results in lower pattern width [35]. The plot further illustrates that influence of gap size on pattern width is insignificant as the line not sharper.…”
Section: Main Effect On Pattern Width and Analysis Of Variancementioning
confidence: 85%
“…From the plot, it is also evident that the mean width increases with increase in pressure. It is due to the higher viscosity of paste and increased discharge rate at high pressure [35]. Moreover, the decreasing trend for substrate speed in the plot shows that pattern width decreases with increase in substrate speed.…”
Section: Main Effect On Pattern Width and Analysis Of Variancementioning
confidence: 92%
“…Printing input parameters selected for the study are pressure, substrate speed and gap size (distance between nozzle tip and surface of the substrate), while output (response variable) is pattern width. Input parameters are selected based on previous studies [10,11,27,28,34,35]. Determining the optimal parameter is one of the challenging tasks, which is beneficial for the industry.…”
Section: Printing Parameters and Design Of Experimentsmentioning
The present work discusses the fabrication of low-cost, reliable and durable flexible electronic circuits from conductive carbon paste on flexible polyethylene terephthalate (PET) substrate using microdispensing direct ink write technique. Printing parameters such as pressure, substrate speed and gap size are optimized through Box-Behnken experimental design technique to achieve the desired quality of prints (patterns). For the nozzle with an inner diameter of 200 µm, the system is able to produce pattern line width ranging from 198 µm to 295 µm, respectively. Based on optimized parameters, circuits such as foil grid and rectangular spiral are printed on a flexible PET substrate. The deposited patterns of circuits are morphologically characterized by optical microscopy and scanning electronic microscopy. Current-Voltage (I-V) characteristic is performed to evaluate the conductive performance of circuits. The sensitivity of circuits to bending is assessed by studying resistance response under fully bend and unbend angle of 90° and 0°. Durability and reliability of circuits are analyzed by subjecting circuits to continuous 500 bend cycles and study its resistance response. The analysis revealed that these direct ink write circuits are reliable, durable and stable in performance and are applicable to the flexible electronic application.
“…There are four major types of non-contact printing technologies: electrohydrodynamic (EHD) jet [23,24], aerosol jet [11][12][13], nozzle dispensing [25] and ink-jet [14]. Although EHD jet and aerosol jet technologies have shown promising results when used to print extremely fine electrodes, multiple commercial vendors are not available and the overall infrastructure offered by current vendors is not matured.…”
Section: Justification For Using Direct Ink-jet Metallizationmentioning
In this study, the direct ink-jet metallization of finger electrodes on a multi-crystalline silicon solar cell is attempted and the impact of the silver particle size on solar cell efficiency is investigated using silver nano-inks with two different silver particle sizes. When the silver particle size approaches the nano-metric regime of around 18.1 nm, the solar cell efficiency is as low as 8.6%. On the other hand, the solar cell efficiency increases up to a maximum of 12.1% using silver particles that are around 180 nm in size. It is found that the dependence of the solar cell efficiency on the silver particle size is related to the effective volume ratio of a dispersant to silver. As the effective volume ratio increases, detrimental effects, such as an explosive decomposition of the dispersant and high residual stress due to the high volumetric shrinkage of a direct ink-jet printed finger electrode, result in poor contact formation which eventually leads to poor solar cell efficiency. With these experimental results, potential development directions for an ink-jet printer for the direct metallization of a silicon solar cell are comprehensively discussed.
“…Several different printing techniques has been developed to overcome the limitation of the conventional screen-printing [5,18,37,74,78], which is the wel-established and robust method to deposit metal contacts in solar cell industrial production. Compare to the screen-printing technique, LIFT makes it competitive to print a tens of micrometer width of the contact fingers with enhanced aspect radio (height/width), resulting in reducing the shading losses on the cell surface and series resistance but higher sheet resistance and conductivity, which finally leads to an increasing efficiency of solar cell.…”
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