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2011
DOI: 10.1016/j.apsusc.2010.11.155
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The fabrication of 3-D nanostructures by a low- voltage EBL

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Cited by 11 publications
(4 citation statements)
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“…Essentially, lowering the soft bake temperature resulted in a reduction of 12.5% in the gap size. This reduction is attributed to the lower degree of polymer chain linking at lower temperatures [22], which leads to a larger volume of PMMA to develop in the exposed regions translating into a decrease in the CDs (i.e. gap size) of features like nanogaps, and conversely an increase in the LW of nanowires.…”
Section: Soft-bake Temperaturementioning
confidence: 99%
“…Essentially, lowering the soft bake temperature resulted in a reduction of 12.5% in the gap size. This reduction is attributed to the lower degree of polymer chain linking at lower temperatures [22], which leads to a larger volume of PMMA to develop in the exposed regions translating into a decrease in the CDs (i.e. gap size) of features like nanogaps, and conversely an increase in the LW of nanowires.…”
Section: Soft-bake Temperaturementioning
confidence: 99%
“…because the ion range in the material (a few nanometers) is much smaller than the typical scale of the wrinkles (fractions of a micrometer). Alternatively, highly ordered anisotropic PDMS patterns have been prepared by replica molding recurring to top-down approaches based on electron beam lithography (EBL) for the fabrication of the master . However, the high costs and limited working area of EBL represent a drawback for device fabrication at the industrial level.…”
Section: Introductionmentioning
confidence: 99%
“…Nano-patterned semiconductor substrates have been widely used in many microelectronic and optoelectronic devices [1][2][3]. Techniques [4][5][6] such as electron beam lithography, focused ion beam lithography and nano-imprint lithography have been applied in the nano-fabrication. To realize miniaturization and performance enhancement of the devices, nanostructures with high resolution in etching depth as well as line width are demanded.…”
Section: Introductionmentioning
confidence: 99%