Annual Reliability and Maintainability Symposium 1995 Proceedings
DOI: 10.1109/rams.1995.513251
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The ESS riddle: physics vs. relics

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Cited by 3 publications
(2 citation statements)
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“…Ramp rate for thermal shock is usually greater than 20°C and it is less than 20°C for thermal cycling [10]. High ramp rates are effective in exaggerating stresses associated with mismatches in coefficients of thermal expansion in metals, plastics, and adhesives [11]. Tests with excessively high ramp rates actually could be ineffective in precipitating flawed solder joints into failures [12].…”
Section: Ramp Ratementioning
confidence: 99%
“…Ramp rate for thermal shock is usually greater than 20°C and it is less than 20°C for thermal cycling [10]. High ramp rates are effective in exaggerating stresses associated with mismatches in coefficients of thermal expansion in metals, plastics, and adhesives [11]. Tests with excessively high ramp rates actually could be ineffective in precipitating flawed solder joints into failures [12].…”
Section: Ramp Ratementioning
confidence: 99%
“…PSEST is typically used as an end-of-line manufacturing screen to precipitate and detect latent defects in order to obviate so-called infant mortality failures. A range of stimuli can be applied during EST [2,7,12] improves, the duration of PSEST may be decreased, eventually yielding to a short test performed on a sampling basis. Conversely, it may be necessary to increase test duration if design or process modifications are implemented.…”
mentioning
confidence: 99%