Generator hollow copper strands are frequently subjected to plug and flow restriction caused by copper oxide deposition. Response surface methodology was used to optimize the three key independent operating parameters, namely temperature, pH, and dissolved oxygen, to decrease copper corrosion. The characterization of chemical features was studied by atomic force microscopy (AFM), scanning electron microscopy (SEM), and X‐ray photoelectron spectroscopy (XPS). The optimum condition was obtained as temperature 60 °C, pH 8.5, and dissolved oxygen 0.04 mg/L. At this applied optimum condition, the corrosion rate and the content of dissolved copper ions could be lower than 0.005 mm y−1 and 25 µg/L, respectively. Increasing pH could decrease both the corrosion rate and the content of dissolved copper ions owing to enhance the height of layer and varied the composition of the film.