The effects of sliding velocity and sliding time on nanocrystalline tribolayer development and properties in copper

Emge, A.; Karthikeyan, S.; Rigney, D.A.

doi:10.1016/j.wear.2008.12.102

Cited by 131 publications

(64 citation statements)

References 7 publications

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“…Indeed similar grain refinement is found in severe plastic deformation processes [12]. Emge et al [13] found similar structures after sliding on copper by using ion channelling on FIB sections. The thickness of the tribologically grain refined (TGR) layer varies depending on location on Fig.…”

Section: Sem Cross Sectionssupporting

confidence: 53%

EBSD, SEM and FIB characterisation of subsurface deformation during tribocorrosion of stainless steel in sulphuric acid

Perret

Boehm-Courjault

Cantoni

et al. 2010

Wear

106

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a b s t r a c tThe tribocorrosion behaviour of a 304L stainless steel/alumina contact was investigated in sulphuric acid at two imposed potentials (cathodic and passive). The metal deformation below the surface was investigated by analyzing cross sections using secondary electron microscopy (SEM) and electron back scatter diffraction (EBSD). Cross sections were also prepared using focussed ion beam (FIB) and analyzed by in situ SEM. AES depth profiling was used to analyze surface composition. Metal subsurface deformation resulted in the build up of a deformed layer of approximately 20 m thickness in the near surface zone within the wear track. This layer exhibited a deformation gradient with high deformation close to the surface resulting in grain refinement down to 10 nm. The applied potential influenced the deformation: at passive applied potential more strain was accumulated below the surface resulting in more pronounced grain refinement and higher density of defects. Using AES analysis no alumina transfer from the counter body or any significant burying of oxide below the surface could be detected.

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Section: Sem Cross Sectionssupporting

confidence: 53%

EBSD, SEM and FIB characterisation of subsurface deformation during tribocorrosion of stainless steel in sulphuric acid

Perret

Boehm-Courjault

Cantoni

et al. 2010

Wear

106

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“…Nevertheless, a recent review indicated that deviations from Archard's law may take place owing to the large plane strains at the contact points and the adhesive transfer and mechanical mixing [7]. Several reports on the tribological behavior of copper [8][9][10] demonstrate the complex nature of wear; specifically, the wear rate may be a function of numerous parameters. Moreover, it was demonstrated very recently that significant grain refinement, and consequently, strengthening, may not lead to improved wear properties in commercial pure copper but rather to an increase in the steady-state wear rate with a consequent decrease in the electroconductivity [11].…”

Section: Introductionmentioning

confidence: 99%

Effect of annealing on wear resistance and electroconductivity of copper processed by high-pressure torsion

et al. 2013

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The influences of annealing temperature on the wear properties and electrical conductivity of Cu were studied after processing by high-pressure torsion (HPT). The annealing of Cu specimens processed by HPT leads to an increase in electroconductivity and a decrease in the wear rate. It is apparent that a nanotribolayer at the surface induced during wear sliding plays a more significant role than the ultrafine-grained structure. A slight increase was observed in the microhardness of HPT copper specimens upon annealing at a relatively low temperature (100°C), and this is most likely due to a change in texture. The annealing leads to an increase in the Taylor factor by *5 %, which is in good agreement with the increase in the microhardness level which is also by *5 %. It is apparent that low-temperature annealing of HPT copper may produce optimal properties of the specimens including high strength and electroconductivity with a lower wear rate.

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“…Other authors have reported that an increase in sliding velocity will generate a thinner near-surface tribolayer consisting of a fine microstructure (even down to the nanoscale) during unlubricated sliding of Cu [18]. Moreover, dynamic recrystallization has been reported to interrupt the formation of a continuous nanocrystalline tribolayer at high sliding velocities [19]. Zhang et al [14] studied the effect of applied load during ball-on-disc sliding of Cu and Ta and reported an increase in the thickness of the deformed layer with increasing normal load.…”

Section: Introductionmentioning

confidence: 99%

Effects of normal stress, surface roughness, and initial grain size on the microstructure of copper subjected to platen friction sliding deformation

Deng

Godfrey

Wei

et al. 2016

Int J Miner Metall Mater

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The effects of applied normal stress, surface roughness, and initial grain size on the microstructure of pure Cu developed during platen friction sliding deformation (PFSD) processing were investigated. In each case, the deformation microstructure was characterized and the hardness of the treated surface layer was measured to evaluate its strength. The results indicated that the thickness of the deformed layer and the hardness at any depth increased with increasing normal stress. A smaller steel platen surface roughness resulted in less microstructural refinement, whereas the microstructural refinement was enhanced by decreasing the surface roughness of the Cu sample. In the case of a very large initial grain size (d > 10 mm), a sharper transition from fine-grain microstructure to undeformed material was obtained in the treated surface layer after PFSD processing.

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The effects of sliding velocity and sliding time on nanocrystalline tribolayer development and properties in copper

Cited by 131 publications

References 7 publications

EBSD, SEM and FIB characterisation of subsurface deformation during tribocorrosion of stainless steel in sulphuric acid

EBSD, SEM and FIB characterisation of subsurface deformation during tribocorrosion of stainless steel in sulphuric acid

Effect of annealing on wear resistance and electroconductivity of copper processed by high-pressure torsion

Effects of normal stress, surface roughness, and initial grain size on the microstructure of copper subjected to platen friction sliding deformation

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