Abstract:Microstructure plays a key role in reliability of interconnects. However, a quantitative correlation between microstructure and reliability of interconnects is lacking. This paper develops a statistical description of effective diffusivity of interconnects by considering grain boundaries, bulk lattice and line interface diffusion, and introduces a microstructure-based electromigration lifetime prediction model for normal failures of interconnects. Further, the probability of early failure of interconnects due … Show more
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