2002
DOI: 10.1016/s0304-8853(01)01163-5
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The effects of metallic underlayers on magnetic properties of obliquely sputtered Co thin films

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Cited by 12 publications
(6 citation statements)
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“…The Cr, Cu and Al under-layers with a layer thickness of 137, 143 and 108 nm, respectively, had a small grain size on the surface, but the Co and Ag under-layers with a layer thickness of 69 and 319 nm, respectively, exhibited a bigger grain size. Nguyen et al (2002) reported that Al could induce a microstructure change by isolating the nuclei and reducing their sizes. A similar effect was observed for Cu under-layer on the sputtered Co film grown on a polymer substrate (Nguyen et al, 2002).…”
Section: Resultsmentioning
confidence: 99%
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“…The Cr, Cu and Al under-layers with a layer thickness of 137, 143 and 108 nm, respectively, had a small grain size on the surface, but the Co and Ag under-layers with a layer thickness of 69 and 319 nm, respectively, exhibited a bigger grain size. Nguyen et al (2002) reported that Al could induce a microstructure change by isolating the nuclei and reducing their sizes. A similar effect was observed for Cu under-layer on the sputtered Co film grown on a polymer substrate (Nguyen et al, 2002).…”
Section: Resultsmentioning
confidence: 99%
“…Nguyen et al (2002) reported that Al could induce a microstructure change by isolating the nuclei and reducing their sizes. A similar effect was observed for Cu under-layer on the sputtered Co film grown on a polymer substrate (Nguyen et al, 2002). Besides this, a Cu under-layer and Au under-layer could also reduce the ordering temperature of sputtered FePt film (Yang et al, 2011) and FePd film (Li et al, 2013), respectively.…”
Section: Resultsmentioning
confidence: 99%
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“…The methods employed to produce these composites are diverse and include screen-printing, molding, wet-etching and squeegee-coating techniques (Delille et al, 2006;Lagorce and Allen, 1997;Wang et al, 2004). Alternative techniques include electroplating and bonding of ferromagnetic materials to polymer films (Takeuchi et al, 2004), ion beam implantation of ferromagnetic ions into polymers (Petukhov et al, 2007), and sputtering of magnetic particles onto polymer substrates (Nguyen et al, 2001;Oka et al, 1995). Future work to miniaturize the current prototype system will involve a critical analysis of microfabrication techniques, their advantages, and potential limitations.…”
Section: Discussionmentioning
confidence: 99%
“…Cobalt based compounds are also popular for magnetic recording media because of their higher recording density and higher coercivity [3]. The magnetization process of Co thin films, multilayer with other noble metals, submicron sized particles, and their patterned structures have been the subject of extensive investigations as they are both promising for industrial applications and important for understanding the fundamental aspects of surface magnetism [4][5][6][7][8].…”
Section: Introductionmentioning
confidence: 99%