The
full-Heusler (FH) inclusions in the half-Heusler (HH) matrix
is a well-studied approach to reduce the lattice thermal conductivity
of ZrNiSn HH alloy. However, excess Ni in ZrNiSn may lead to the in
situ formation of FH and/or HH alloys with interstitial Ni defects.
The excess Ni develops intermediate electronic states in the band
gap of ZrNiSn and also generates defects to scatter phonons, thus
providing additional control to tailor electronic and phonon transport
properties synergistically. In this work, we present the implication
of isoelectronic Ge-doping and excess Ni on the thermoelectric transport
of ZrNiSn. The synthesized ZrNi1.04Sn1–x
Ge
x
(x = 0–0.04) samples were prepared by arc-melting and spark
plasma sintering, and were extensively probed for microstructural
analysis. The in situ evolution of minor secondary phases, i.e., FH,
Ni–Sn, and Sn–Zr, primarily observed post sintering
resulted in simultaneous optimization of the electrical power factor
and lattice thermal conductivity. A ZT of ∼1.06
at ∼873 K was attained, which is among the highest for Hf-free
ZrNiSn-based HH alloys. Additionally, ab initio calculations based
on density functional theory (DFT) were performed to provide comparative
insights into experimentally measured properties and understand underlying
physics. Further, mechanical properties were experimentally extracted
to determine the usability of synthesized alloys for device fabrication.