2005
DOI: 10.1149/1.1878353
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The Effects of an Oxide Layer on the Kinetics of Metal-Induced Crystallization of a-Si:H

Abstract: The effect of a native silicon dioxide layer on metal-induced crystallization of hydrogenated amorphous silicon ͑a-Si:H͒ was investigated. Several samples, deposited by the plasma-enhanced chemical vapor deposition technique, were exposed to different ambients for different times to allow for the growth of SiO 2 layers of different thicknesses. Then, aluminum was used to crystallize the samples using metal-induced crystallization at temperatures far below the solid-phase crystallization temperature of a-Si. In… Show more

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Cited by 10 publications
(5 citation statements)
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“…Although a-Si:H(i)/a-Si:H(n)/Al and a-Si:H(i)/a-Si:H(p)/ Al contacts have different stability challenges with increasing annealing temperature, each type could benefit by buffering the onset of Al diffusion at its interface with the doped a-Si:H. This could be done by tuning the oxidation of the a-Si:H stack before Al deposition. This is a known approach to slow the interdiffusion process by increasing the Al-Si distance, but must be implemented in a way that does not become prohibitively resistive [42]. Another approach is to incorporate Si into the Al sputter target, which may reduce the driving force for Al diffusion into the a-Si:H layers and the strength of the Si-Si and Si-H bond screening compared to pure Al [43].…”
Section: Discussionmentioning
confidence: 99%
“…Although a-Si:H(i)/a-Si:H(n)/Al and a-Si:H(i)/a-Si:H(p)/ Al contacts have different stability challenges with increasing annealing temperature, each type could benefit by buffering the onset of Al diffusion at its interface with the doped a-Si:H. This could be done by tuning the oxidation of the a-Si:H stack before Al deposition. This is a known approach to slow the interdiffusion process by increasing the Al-Si distance, but must be implemented in a way that does not become prohibitively resistive [42]. Another approach is to incorporate Si into the Al sputter target, which may reduce the driving force for Al diffusion into the a-Si:H layers and the strength of the Si-Si and Si-H bond screening compared to pure Al [43].…”
Section: Discussionmentioning
confidence: 99%
“…Metal induced crystallization (MIC) has been reported to obtain crystalline films of Si and Ge from amorphous Si (a-Si) and amorphous Ge (a-Ge) at low temperatures (150-200°C) [3]. In this process, large grains of poly-Si and poly-Ge with sizes of a few millimeters can be obtained.…”
Section: Introductionmentioning
confidence: 99%
“…The grain sizes of the processed films are in the order of few microns. Metal induced crystallization (MIC), on the other hand, has been reported to obtain large grains (~ 150 micros) polycrystalline films of Si and Ge at low temperatures (150-200°C) [3] at much lower cost. The results indicated that the interface layer comprising of the semiconductor oxide between metal and the amorphous film plays an important role in the crystallization process.…”
Section: Introductionmentioning
confidence: 99%