Superconformal Cu electroless deposition is demonstrated in a CuSO 4 -EDTA-HCHO ͑where EDTA is ethylenediaminetetraacetic acid͒ electrolyte containing 2-mercapto-5-benzimidazolesulfonic acid ͑MBIS͒. MBIS reveals a concentration-dependent effect in the deposition rate on planar substrates, whereby acceleration at low concentration and suppression at high concentration are evident. The half-cell reaction experiments show that the acceleration effect of MBIS is mainly associated with the cathodic reaction, while MBIS inhibits the oxidation of HCHO in the anodic reaction. The addition of MBIS offers preferential Cu electroless deposition at the bottom of 500 nm wide trenches. Poly͑ethylene glycol͒ improved the surface roughness, maintaining the shape evolution of superconformal feature filling. © 2009 The Electrochemical Society. ͓DOI: 10.1149/1.3117343͔ All rights reserved.Manuscript submitted December 9, 2008; revised manuscript received February 3, 2009. Published April 21, 2009 Superconformal Cu electrodeposition has been successfully implemented in the metallization of electronic devices, thereby enabling the buildup of multilevel interconnects for ultralarge-scale integration ͑ULSI͒.
1Electroless Cu deposition has been mainly used in an area of printed circuit boards to form seed layers ͑conductive path͒ for Cu electrodeposition in high aspect ratio through-holes, taking advantage of its ability to metallize nonconductive epoxy glasses, polyimides, etc.2,3 Recent research on Cu electroless deposition has extended its application to seed layer deposition for Cu electrodeposition in ULSI interconnect fabrication, with increasing advantages over alternative methods as the feature size decreases to a submicrometer scale.4,5 Electroless deposition is a surface limited reaction that enables the deposition of considerably thin and uniform Cu seed layers with a superior step coverage compared to physical vapor deposition ͑PVD͒ or chemical vapor deposition seed layers. 6,7 Contrary to the conventional method that utilizes a conformal deposition property of electroless Cu, a superfilling of submicrometer features such as trenches or vias using only electroless deposition has also been attempted in several publications. [8][9][10][11][12] The most important factor that determines the feature-filling profiles is the effect of additives. In electrodeposition, a quantitative understanding of superconformal electrodeposition can be described by the curvature enhanced accelerator coverage ͑CEAC͒ mechanism that is derived from the competitive adsorption between additive species that accelerate and inhibit the deposition rate coupled with electrode area change. 13,14 The use of additives in Cu electroless deposition has been largely concerned with stabilizing the electrolyte or enhancing the physical properties of films, while the effect on feature filling has received less attention.In previous work, we have achieved superconformal Cu electroless deposition in the presence of bis-͑3-sulfopropyl͒-disulfide ͑SPS͒ 9,10 and 3-N,N-...