The effect of the graded bilayer design on the strain depth profiles and microstructure of Cu/W nano-multilayers

Ag Surface Outflow Kinetics in Ag/AlN Nanomultilayers

“…[ 1 ] The profound interest in these nanomaterials relies on the combination of different unique physical properties, namely mechanical, [ 2 ] optical, [ 3 ] and magnetic properties [ 4 ] and radiation tolerance. [ 5 ] Superposition of excellent physical properties can be achieved by smart microstructural design (e.g., selection of the bilayer combination, [ 6 ] interfacial design [ 7 ] ) coupled with appropriate heat‐treatment conditions (temperature, duration, annealing atmosphere [ 8,9 ] ).…”

“…[1] The profound interest in these nanomaterials relies on the combination of different unique physical properties, namely mechanical, [2] optical, [3] and magnetic properties [4] and radiation tolerance. [5] Superposition of excellent physical properties can be achieved by smart microstructural design (e.g., selection of the bilayer combination, [6] interfacial design [7] ) coupled with appropriate heat-treatment conditions (temperature, duration, annealing atmosphere [8,9] ).NMLs are created by periodically stacking nanolayers of selected materials along the substrate's normal direction (bilayer composition). The synthesis of an NML yields a metastable framework owing to the high density of internal interfaces (interphase boundaries, grain boundaries) with associated surface energies.…”

“…Residual stresses in nanolayers typically arise during the NML growth, contributing additional elastic energy to the final nonequilibrium state of the system. [6,[16][17][18][19][20] When depositing polycrystalline nanolayers (which are typical in NMLs), there is classical model describing the compressive-tensile-compressive residual stress transition with an increase in film thickness. This transition is related to the mutual interaction of growing islands and adatom incorporation into the film.…”

Explaining the Effect of In-Plane Strain on Thermal Degradation Kinetics of Cu/W Nano-Multilayers

“…The immiscible copper/tungsten (Cu/W) system has attracted attention in the scientific community in the last years because of the combination of the good electrical and thermal properties of Cu with the excellent mechanical properties of W [1][2][3][4]. This finds multiple applications as heat sinks in electronic devices, nuclear fusion components, or packaging components [3,5].…”

“…This finds multiple applications as heat sinks in electronic devices, nuclear fusion components, or packaging components [3,5]. Due to the complete immiscibility between Cu and W, interface effects play an important role in these structures and the resulting mechanical, optical, magnetic, thermal, and electronic properties of the system can be tailored through microstructural and interfacial design [4]. The interface structure in immiscible fcc/bcc metallic systems is complex and still not well understood [6,7], but it plays a decisive role in the properties and stability of Cu/W nanomultilayers (NMLs) [2].…”