The effect of the chuck shape on the wafer topography in back grinding of wafer with outer rim

Abstract

Back Grinding of Wafer with Outer Rim (BGWOR) is a novel method for carrier-less thinning of silicon wafers. Silicon wafers are widely used in integrated circuits (ICs). The topography of the wafer will not only directly affect the efficiency of subsequent processing of semiconductor devices, but correspondingly affect the performance and life of these devices. However, there are few studies on the shape of the ground wafer in BGWOR. In this paper, the mathematical model of the wafer topography in BGWOR was developed. With this model, the radial thickness and total thickness variation (TTV) of a wafer under different parameters, including inclination angles and radii of grinding wheel for dressing chuck, were simulated by MATLAB. Inclination angles and radii of grinding wheels for the dressing chuck had a great influence on the radial thickness and TTV of a wafer in the BGWOR. Lastly, the pilot experiments were conducted to validate the theoretical model of grinding topography and TTV of the wafer in BGWOR. To enhance the flatness of the ground wafer, it is essential to control the shape of the dressing chuck. The research results are helpful to the optimization of the dressing process of the chuck in the BGWOR.

An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process

“…Their model predicted the variation trend of wafer TTV characteristic and chuck table shape, and qualitative experiments were conducted to validate the simulation results. Guo et al [17,18] studied the numerical model for a novel grinding process with an outer rim remained on the wafer, to obtain the characteristics of grinding marks and TTV under the given process conditions. They pointed out that the inclination angles had great influence on the wafer TTV features.…”