2018
DOI: 10.1063/1.5045040
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The effect of surface heterogeneities in exploding metal foils

Abstract: Abstract. During the electrical explosion of bridge-wires and bridge-foils, the metal bridge undergoes rapid resistive-heating. The metal is rapidly expanded through solid, liquid, vapour and plasma phases. This study uses ALEGRA MHD, a Sandia National Laboratory magneto-hydrocode, to predict the formation of these metallic phases during the explosion process and determine the effects of surface heterogeneities on the spatial distribution of these phases. The simulations are compared against x-ray phase contra… Show more

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Cited by 7 publications
(2 citation statements)
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“…The increased resistivity, and therefore heating, of locations across the wire lead to a variety of thermodynamic states throughout the entirety of the wire. This phenomenon has also been witnessed in real detonator components; both EBWs [25] and EFI detonators [26,27]. Figure 8 and Figure 9 show the results of these EFI and EBW studies respectively and it can be seen in both that the density varies dramatically during explosion as a result of ETI.…”
Section: Electrothermal Instabilitiessupporting
confidence: 62%
“…The increased resistivity, and therefore heating, of locations across the wire lead to a variety of thermodynamic states throughout the entirety of the wire. This phenomenon has also been witnessed in real detonator components; both EBWs [25] and EFI detonators [26,27]. Figure 8 and Figure 9 show the results of these EFI and EBW studies respectively and it can be seen in both that the density varies dramatically during explosion as a result of ETI.…”
Section: Electrothermal Instabilitiessupporting
confidence: 62%
“…Magnetron sputtering and photolithography are commonly employed processes for fabricating blast foil transducer elements [8][9][10]. During the fabrication of metal bridge foils, various defects of different shapes and depths such as blind holes, through-holes, and scratches can arise on the surface of the exploded foil transducer element due to factors such as holes, pits, burrs, foreign particulate matter, and target droplets on the substrate surface [11][12][13][14][15]. Eliminating film defects entirely is challenging [16], and even when films are deposited using HiPIMS, an advanced physical deposition method, a significant number of defects can still occur [17].…”
Section: Introductionmentioning
confidence: 99%