The effect of sulphur and carbon inclusions on the corrosion resistance of electrodeposited Ni-Fe alloy coatings

Kouncheva, M.; Raichevski, G.; Vitková, S.; Pražák, M.

doi:10.1016/0257-8972(87)90066-1

Cited by 18 publications

(11 citation statements)

References 2 publications

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“…This trend makes a microcavity-based solution entrapment unlikely. Rather, the sulfur incorporation can be explained by the decomposition of the saccharin which acts as sulfur source in accordance with the following reaction [20]:…”

Section: Composition Analysismentioning

confidence: 99%

Effect of bath additives on the microstructure, lattice defect density and hardness of electrodeposited nanocrystalline Ni films

Kolonits

Jenei

Péter

et al. 2018

Surface and Coatings Technology

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Experiments were performed for the study of the influence of impurities on the microstructure and hardness of nanocrystalline Ni films. The samples were prepared by electrodeposition using two basic electrolyte solutions (a sulfate-type bath and a Watts-type bath). The effect of saccharin as organic additive on the microstructure, texture and hardness was studied. It was found that the Watts bath without saccharin yielded a larger grain size compared to its sulfatetype counterpart. For both electrolyte solutions, (220) out-of-plane texture was formed in the saccharin-free films. The additive saccharin eliminated the texture and yielded very fine microstructures with high dislocation densities and twin fault probabilities for both solution types. The influence of saccharin on the defect density was higher for the film prepared from the sulfate-type bath. It was revealed that there is a correlation between the defect density and the grain size. When saccharin was added to the Watts bath, the combined effect of nickelchloride and saccharin led to a bimodal grain size distribution. An additional sample was deposited from an electrolyte containing trisodium citrate to investigate the sodium incorporation in the Ni layers. The correlation between the microstructure and the hardness of the films was discussed in detail.

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Section: Composition Analysismentioning

confidence: 99%

Effect of bath additives on the microstructure, lattice defect density and hardness of electrodeposited nanocrystalline Ni films

Kolonits

Jenei

Péter

et al. 2018

Surface and Coatings Technology

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“…For example, in the as-deposited sample in Figure 4A, the gradient of the C concentration is in fact higher than that of O. Furthermore, the annealed sample at 320 C ( Figure 4B) Sulphur has been considered as a polluting element in both electrodeposited pure Ni [24][25][26] and Ni-Fe alloys 18,22,27,28 originating from saccharin in the bath. It is likely to be trapped in the film during deposition.…”

Section: Discussionmentioning

confidence: 99%

Correlation between the bath composition and nanoporosity of DC‐electrodeposited Ni‐Fe alloy

Maizza

Pero

Kačiulis

et al. 2020

Surface & Interface Analysis

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The outstanding mechanical strength of as‐deposited DC‐electrodeposited nanocrystalline (nc) Ni‐Fe alloys has been the subject of numerous researches in view of their scientific and practical interest. However, recent studies have reported a dramatic drop in ductility upon annealing above 350°C, associated with a concomitant abnormal rapid grain growth. The inherent cause has been ascribed to the presence of a detrimental product or by product in the bath, which affects either the microstructure or causes defects in the concentration and/or distribution of the as‐deposited films. The present work has been inspired by the observed abnormal behaviour of annealed electrodeposited nc Ni‐Fe alloy, which has here been addressed by considering the relationship between the composition of the bath (iron‐chloride, nickel‐sulphate solution, saccharin and ascorbic acid) and deposition defects (e.g. grain boundary pores) in the case of an nc Ni‐Fe (Fe 48 wt%) alloy. The current investigations have included X‐ray photoelectron spectroscopy (XPS), field emission scanning electron microscopy (FESEM) and transmission electron microscopy (TEM) in both as‐deposited and post‐annealed conditions (300°C–400°C). XPS depth profiling with Ar ion sputtering showed a significant amount of C and O impurities entrapped in the foils during deposition. As such impurities are often overlooked in common analytical techniques, new scenarios may need to be rationalised to explain the observed drop in tensile ductility of the as‐deposited Ni‐Fe alloys.

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“…Hence, the sulfur inclusion has a contribution to the grain refinement. According to the above reaction pathway, the enhancement of carbon inclusion is not a necessary consequence of the sulfur inclusion [69].…”

Section: Effect Of Additives On the Microstructure And Defect Formationmentioning

confidence: 96%

“…Beside the hindrance of the characteristic crystal growth sites, saccharine also decomposes upon the electrodeposition of Ni, resulting in benzamide formation and sulfur inclusion [69]:…”

Section: Effect Of Additives On the Microstructure And Defect Formationmentioning

confidence: 99%

Characterization of Defect Structure in Electrodeposited Nanocrystalline Ni Films

Kolonits

Jenei

Tóth

et al. 2015

J. Electrochem. Soc.

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The microstructure of electrodeposited Ni films produced without and with organic additives (formic acid and saccharin) was investigated by X-ray diffraction (XRD) line profile analysis and cross-sectional transmission electron microscopy (TEM). Whereas the general effect of these additives on the microstructure (elimination of columnar growth as well as grain refinement) was reproduced, the pronounced intention of this study was to compare the results of various seldom-used high-performance structural characterization methods on identical electrodeposited specimens in order to reveal fine details of structural changes qualitatively not very common in this field. In the film deposited without additives, a columnar structure was observed showing similarities to the T-zone of structure zone models. Both formic acid and saccharin additives resulted in equiaxed grains with reduced size, as well as increased dislocation and twin fault densities in the nanocrystalline films. Moreover, the structure became homogeneous and free of texture within the total film thickness due to the additives. Saccharin yielded smaller grain size and larger defect density than formic acid. A detailed analysis of the grain size and twin boundary spacing distributions was carried out with the complementary application of TEM and XRD, by carefully distinguishing between the TEM and XRD grain sizes.

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The effect of sulphur and carbon inclusions on the corrosion resistance of electrodeposited Ni-Fe alloy coatings

Cited by 18 publications

References 2 publications

Effect of bath additives on the microstructure, lattice defect density and hardness of electrodeposited nanocrystalline Ni films

Effect of bath additives on the microstructure, lattice defect density and hardness of electrodeposited nanocrystalline Ni films

Correlation between the bath composition and nanoporosity of DC‐electrodeposited Ni‐Fe alloy

Characterization of Defect Structure in Electrodeposited Nanocrystalline Ni Films

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