The effect of structure on thermal stability and anti-oxidation mechanism of silicone modified phenolic resin

Li, Shan; Han, Yue; Chen, Fenghua; Luo, Zhenhua; Li, Hao; Zhao, Tong

doi:10.1016/j.polymdegradstab.2015.12.010

Cited by 81 publications

(31 citation statements)

References 41 publications

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“…In particular, the change is very obvious when the content of DMS-E09 is 20 wt%, which indicates the weakening of the interfacial interactions. 31,47 Moreover, as shown in the magnified in section of Figure 3 marked by a solid red rectangle, where epoxy-rich particles of 5-20 μm can be found in PEI-rich phases. This is an indication of a secondary phase separation or, more precisely, a local phase inversion during a certain stage of curing reaction.…”

Section: Effect Of Tertiary Dms-e09 On the Formation Of Co-continuomentioning

confidence: 92%

Effect of tertiary polysiloxane on the phase separation and properties of epoxy/PEI blend

Zhen

et al. 2020

J of Applied Polymer Sci

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Epoxy functional siloxane (DMS‐E09) was blended with epoxy resin (DGEBA) and thermoplastic polyetherimide (PEI). The results of morphology monitoring indicated that the reaction induced phase separation for all blends followed the spinodal phase separation mechanism. The microstructure changed from co‐continuous of 25 wt% epoxy/PEI system to phase‐inversion structure of 30 wt% epoxy/PEI system regardless of the content of the tertiary component DMS‐E09. By comparing the onset time of phase separation between the two designated systems, the sequential occurrence of primary macrophase separation in co‐continuous phase and secondary microphase separation in PEI‐rich phase for 25 wt% epoxy/PEI system was identified. Studies of the thermomechanical properties of the DGEBA/PEI/DMS‐E09 blends found that storage modulus increased with the addition of PEI but decreased with DMS‐E09 monotonically. The value of Tg decreased with the addition of the tertiary DMS‐E09 but was offset partially by the presence of PEI.

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Section: Effect Of Tertiary Dms-e09 On the Formation Of Co-continuomentioning

confidence: 92%

Effect of tertiary polysiloxane on the phase separation and properties of epoxy/PEI blend

Zhen

et al. 2020

J of Applied Polymer Sci

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“…Bis-ANER was cured using Bis-ABNR as curing agent, and was analyzed by using thermogravimetric analysis and differential scanning calorimetry. The heat resistance measurements of the cured product revealed that the cured product has a glass transition temperature (T g ) of 165 C and an initial thermal decomposition temperature (T d ) of 309.85 C, showing high thermal stability; Li S. et al 23 prepared organosilicon phenolic resin by esterication of methyl trimethylsilane with novolac resin, and studied the thermal decomposition properties of the resin by using a thermogravimetric analyzer. The results showed that the initial thermal degradation temperature of the silicone-modied phenolic resin was 411.6 C, which was 21.5 C higher than the initial thermal degradation temperature of the unmodied PF.…”

Section: Research Status Of Phenolic Resin Adhesivementioning

confidence: 99%

Research status, industrial application demand and prospects of phenolic resin

et al. 2019

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“…Firstly, the combination between DOPO‐KH560 and the phenol decreases the number of PhOH, and is replaced with SiOH. According to the literature, the condensation among PhOH has higher activity than that among SiOH. Secondly, the introduced DOPO‐KH560 has a bulky structure and the steric hindrance caused by the rigid groups slows down the curing reaction to a certain degree.…”

Section: Resultsmentioning

confidence: 77%

Preparation and properties of phosphorus‐ and silicon‐modified phenolic resin with high ablation resistance

Yuan

Wang

2019

Polymer International

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In order to further improve the ablation resistance of common phenolic resins, a modified phenolic resin containing phosphorus and silicon (SPPR) was synthesized and the corresponding properties were evaluated. With phosphorus and silicon involved in the macromolecule, SPPR showed excellent flame retardancy and obviously enhanced value (44.8%) of the limiting oxygen index. The thermal stability and charring performance of SPPR were greatly improved, with maximum decomposition temperature of over 500 ∘ C and carbon yield of 60.1% in nitrogen. Differential scanning calorimetry indicated that the curing temperature shifted from 157 ∘ C for the conventional phenolic resin to 182 ∘ C for SPPR. Moreover, an improvement of impact strength from 4.3 to 16.5 kJ m −2 confirmed that incorporation of flexible Si-O chain had a noticeable effect on the mechanical properties of SPPR. Such a modified phenolic resin has promising application prospects serving as an ablation material with high performance.

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The effect of structure on thermal stability and anti-oxidation mechanism of silicone modified phenolic resin

Cited by 81 publications

References 41 publications

Effect of tertiary polysiloxane on the phase separation and properties of epoxy/PEI blend

Effect of tertiary polysiloxane on the phase separation and properties of epoxy/PEI blend

Research status, industrial application demand and prospects of phenolic resin

Preparation and properties of phosphorus‐ and silicon‐modified phenolic resin with high ablation resistance

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