This paper investigated the influence of heat treatment (T6) on the dry sliding wear behavior of SiCp/Al-5Si-1Cu-0.5Mg composite that was fabricated by electromagnetic stirring method. The wear rates and friction coefficients were measured using a pin-on-disc tribometer under loads of 15-90 N at dry sliding speeds of 100 r/min, 200 r/min, and 300 r/min, over a sliding time of 15 min. The worn surfaces and debris were examined using a scanning electron microscope and was analyzed with an energy dispersive spectrometer. The experimental results revealed that SiCp/Al-5Si-1Cu-0.5Mg alloy treated with T6 exhibited lower wear rate and friction coefficient than the other investigated alloys. As the applied load increased, the wear rate and friction coefficient increased. While, the wear rate and friction coefficient decreased with the sliding speed increasing. The morphology of the eutectic silicon was spheroidal after the T6 heat treatment. SiCp particles and Al 2 Cu phase can be considered as the main raisons for improving the wear behavior. Abrasion and oxidation were the wear mechanisms at low load levels. However, the wear mechanisms at high load levels were plastic deformation and delamination.