The Effect of Sputter Cathode Design on Deposition Parameters

Abstract

Recent advances in the classic magnetron sputter cathode design have enabled higher quality thin films and improved deposition rates. New designs that have eliminated traditional sputter target hold down fixtures and the retraction of the dark space shield have greatly increased the available sputter target surface area while reducing the probability of re-deposition of target material on cathode components that could lead to shorting and contamination. Hermetic sealing strategies have mitigated gas permeation through the sputter cathode and enabled lower operating pressures which substantially reduces process gas inclusions in sputtered films. SUMMARY FIGURE 1: Sputtering process where an incoming ion collides with a sputter target ejecting a sputter target surface atom and a secondary electron. (Source: Green et al. [1] / AIP Publishing)

Effect of Fe2O3 Nanoparticles Dust on the D.C Plasma Characteristics with Mirror Magnetron

“…So a skillful control is needed [3]. Magnetron sputtering technique has grown quickly in the last two decades, in response to the increased need for superior efficient films in many fields [4]. Magnetron sputtering now frequently outperforms alternative processes for coatings [1].…”