The effect of Sn segregation at grain boundary on the steady-state creep of Cu-10 wt % Sn alloy

Graiss, G.; Saad, Gamal R.; Fawzy, A.; Kenawy, M. A.

doi:10.1007/bf01598134

Cited by 12 publications

(7 citation statements)

References 8 publications

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“…Finally, Si addition to iron also increases significantly its γSFE, to values as high as 0.2 J/m 2 [10], thus the annealing behaviour of Si added steels is strongly modified with recovery being promoted at the expense of recrystallisation, compared to pure Fe [8]. Meanwhile, the effect of solute Sn in recovery of other metallic materials has been reported, mainly for fcc systems with studies on Cu-Sn alloys discussing the effect due to segregation on dislocations [11,12,13]. For instance, Song et al [14] studied the pinning effect of Sn solutes on grain boundary dislocation dissociation in Al-Mg alloys.…”

Section: Introductionmentioning

confidence: 99%

A multi-scale study of the interaction of Sn solutes with dislocations during static recovery in α-Fe

et al. 2019

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The properties of engineering materials can be improved by optimising the microstructural developments during annealing processes. Here, we investigate the effect of Sn on the recovery annealing of cold rolled Fe-3%Si alloys. We use a multiscale approach combining micro hardness, electron back scattering diffraction (EBSD), and dark field X-ray microscopy (DFXM): a recent, nondestructive synchrotron-based technique that allows 3D mapping of orientation and lattice strain within individual grains embedded in bulk samples. Micro hardness results show that the Sn solute has a strong effect on the recovery kinetics. These results are compared to a physical kinetic model suggesting that Sn limits the softening. This observation is further discussed by a complementary atomistic modelling that demonstrates solute-dislocation interaction around edge dislocations. In situ DFXM experiments reveal the 3D microstructural evolution upon annealing at the grain level with high angular resolution. The DFXM observations show that Sn slows the recovery kinetics within individual grains, in agreement with the other microscopic investigations. Furthermore, the DFXM results provide a direct observation of strain fields around dislocation loops in an embedded single grain, which is argued to remain static due to solute effect during recovery.

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Section: Introductionmentioning

confidence: 99%

A multi-scale study of the interaction of Sn solutes with dislocations during static recovery in α-Fe

et al. 2019

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“…9 The value of 170 kJ mol 21 for activation energy at high stress regime can be attributed to dislocation climb controlled process. 44 2. It is demonstrated that the transition to n<5?5 is consistent with a breakaway of the dislocations from their solute atmospheres.…”

Section: Possibility Of Breakdown Of Dislocations From Their Solute Amentioning

confidence: 99%

Examination of breakdown stress in creep by viscous glide in Al–5·5 at.-%Mg solid solution alloy at high stress levels

Graiss¹,

El‐Rehim²

2007

Materials Science and Technology

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Creep tests on Al-5?5 at.-%Mg solid solution alloy show that the stress exponent n increases with increasing stress from 3?1 to 5?5. It is demonstrated that the transition to n<5?5 is not consistent either with normal power law breakdown or with a transition to a region of viscous glide controlled by pipe diffusion, but the results are in good agreement with a breakdown of the dislocations from their solute atmospheres. The activation energies for creep at low and high stresses are 136 and 170 kJ mol 21 respectively.

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“…This result was explained by proposing that grain boundaries limit the distance which dislocation travels in slip bands. In creep experiments on Cu-10 wt% Sn alloy, it was found [4] that ε • s increased with grain size for all applied stresses and temperatures. This was rendered to the effect of Sn addition on the nature of grain boundaries obtained during grain growth.…”

Section: Introductionmentioning

confidence: 95%

Creep Characteristics of Ag-4 wt% Cu Alloy at High Stresses

2001

Egyptian Journal of Solids

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Creep characteristics of α-solid solution Ag-4 wt% Cu alloy samples of different grain diameters have been investigated under high stresses ranged from 151-193 Mpa at RT. The creep results showed that the transient creep parameter n increases linearly with grain diameter d, while β varied with d 2 according to an empirical relation β= β o +kd 2. This was explained on the basis of internal dislocation processes associating the creep deformation. A critical stress, σ c , needed for initiating the creep process was observed from the dependence of β on σ. The steady state rate ε • s was found to vary with d. The stress exponent m* varied linearly with grain diameter. The obtained higher values of m* were attributed to the transition of the velocity of dislocation climb from a linear to an exponential function of stress. The dependence of ε • s on β was found to be valid with the exponent γ which has a value of 0.6.

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The effect of Sn segregation at grain boundary on the steady-state creep of Cu-10 wt % Sn alloy

Cited by 12 publications

References 8 publications

A multi-scale study of the interaction of Sn solutes with dislocations during static recovery in α-Fe

A multi-scale study of the interaction of Sn solutes with dislocations during static recovery in α-Fe

Examination of breakdown stress in creep by viscous glide in Al–5·5 at.-%Mg solid solution alloy at high stress levels

Creep Characteristics of Ag-4 wt% Cu Alloy at High Stresses

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