1994
DOI: 10.1016/0026-2692(94)90159-7
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The effect of process parameters on dc self-bias voltage in reactive ion etching of GaAs using CH4/H2

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“…Sahafi et al reported that the self-bias voltage of RIE dominates the etching process, which is related to the pressure, RF power, and chamber atmosphere. Usually, the ion flux drifts toward the cathode after being accelerated by the self-bias voltage.…”
Section: Resultsmentioning
confidence: 99%
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“…Sahafi et al reported that the self-bias voltage of RIE dominates the etching process, which is related to the pressure, RF power, and chamber atmosphere. Usually, the ion flux drifts toward the cathode after being accelerated by the self-bias voltage.…”
Section: Resultsmentioning
confidence: 99%
“…In contrast, the conical SWSs with a height of ∼400 nm were obtained, when the self-bias voltage increased from 280 to 420 V by separating the earth frame from the sample stage, while maintaining other parameters constant (Figure 4e). Sahafi et al 44 reported that the self-bias voltage of RIE dominates the etching process, which is related to the pressure, RF power, and chamber atmosphere. Usually, the ion flux drifts toward the cathode after being accelerated by the self-bias voltage.…”
Section: ■ Experimental Sectionmentioning
confidence: 99%