The effect of pre-existing voids on solder reliability at different thermomechanical stress Levels: Experimental assessment

Waseem, Abbas; Ibrahim, Mesfin Seid; Lu, Chang; Waseem, Muhammed; Lee, Hiu Hung; Loo, K.H.

doi:10.1016/j.matdes.2023.112275

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The effect of pre-existing voids on solder reliability at different thermomechanical stress Levels: Experimental assessment

Cited by 3 publications

References 21 publications

A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms

A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms

Effect of solder void on mechanical and thermal properties of flip-chip light-emitting diode: Statistical analysis based on finite element modeling

Investigation of Power Device Solder Void Formation by Two-Phase Flow Simulation

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