The spin coating of polymer solutions onto silicon
substrates was investigated using both
commercially formulated polyimide precursors and model polymer
solutions. The latter included
solutions of polystyrene, polymethyl methacrylate and
poly(ethylene oxide) in appropriate
solvents. Experiments were conducted to determine the influence of
the various process,
material, and geometrical variables on the thickness and thickness
uniformity of films deposited
on planar as well as patterned substrates; dry film thickness was
measured with the help of
profilometry. For flat substrates, the film thickness decreased
with increasing spin speed, and,
in the case of volatile solvents, increasing solvent volatility led to
thicker films. Although solution
viscosity could be changed by changing either the polymer concentration
or the molecular weight,
film thickness was more sensitive to changes in concentration.
Process conditions that gave
thicker films also tended to yield more uniform films. From
experiments on substrates with
topography, it is concluded that low spin speeds in conjunction with
concentrated solutions of
low molecular weight polymer in nonvolatile solvents favor
planarization.