2003
DOI: 10.1016/s0032-3861(03)00372-0
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The effect of particle–matrix adhesion on the mechanical behavior of glass filled epoxies. Part 2. A study on fracture toughness

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Cited by 173 publications
(98 citation statements)
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“…Similarly, Green et al [49] demonstrated pinning with 132 µm diameter particles, but δ tc = 0.3 μm and the diameter of the plastic zone was less than 60 μm (conservative estimates calculated assuming that the yield stress is equal to the quoted fracture stress). Others [10,13,45,46] have invoked pinning though the lack of microscopic evidence makes it difficult to establish whether pinning really occurred. Norman and Robertson [52] observed no bowing lines on the fracture surfaces and discounted crack pinning, finding that off-plane processes dominated the toughening effect.…”
Section: Crack Pinningmentioning
confidence: 99%
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“…Similarly, Green et al [49] demonstrated pinning with 132 µm diameter particles, but δ tc = 0.3 μm and the diameter of the plastic zone was less than 60 μm (conservative estimates calculated assuming that the yield stress is equal to the quoted fracture stress). Others [10,13,45,46] have invoked pinning though the lack of microscopic evidence makes it difficult to establish whether pinning really occurred. Norman and Robertson [52] observed no bowing lines on the fracture surfaces and discounted crack pinning, finding that off-plane processes dominated the toughening effect.…”
Section: Crack Pinningmentioning
confidence: 99%
“…silica or alumina) particles with a diameter of between 4 and 100 μm are typically used, e.g. [9][10][11][12][13][14].…”
Section: Introductionmentioning
confidence: 99%
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“…With the development of epoxy composite material with both high thermal conductivity and excellent mechanical properties in various areas of weight-sensitive aerospace industry, marine, armor, automobile, railway and sporting goods industries, filling inorganic particles of nanometer size with high thermal conductivity and excellent mechanical performance has become a attractive and effective method to strengthen the properties of epoxy resins and meet the higher requirements. Because micro-scale fillers have successfully been synthesized with epoxy resin, BN as a novel nano-scale filler material, which include globular BN, flake BN and fibrous BN, is now being tested to produce high performance composite structures with enhanced properties [1][2][3][4][5][6][7][8][9][10][11][12][13][14]. Recently, boron nitride (BN) based nanofillers such as BN nanoplatelets, BN nanosheets (BNNSs) and BN nanotubes (BNNTs) have attracted increased attention due to its low density, high thermal conductivity, electrical insulation, superb oxidation resistance, passivity to reactions with acids and melts, low coefficient of friction and their potential application in preparing polymer composites for thermal dissipation [15][16].…”
Section: Introductionmentioning
confidence: 99%
“…5 vol%) increases the compressive yield stress, but additional amounts of filler decrease the compressive yield stress [26]. However, tests on glass-bead-filled epoxy (DOW DER 331/bisphenol-A) found that increasing the volume fraction increased both the yield stress and fracture toughness of the material [27,28]. In another study on a similar material, decreasing the aluminium particle size from micro to nano resulted in increased epoxy cross-link density and subsequently increased both static and dynamic strength [15].…”
mentioning
confidence: 99%