The Effect of Multiple Solder Reflows on the Formation of Cu6Sn5 Intermetallics and the Decomposition of SnAg3.0Cu0.5 Solder Joints in the Framework of Rework and Reuse of MLCC Components
Erik Wiss,
Steffen Wiese
Abstract:A rework of electronic assemblies and the reuse of electronic components are the most effective ways to reduce electronic waste. Since neither components nor substrates were developed with the intention of multiple usage, the question of how the integrity of lead-free solder joints is affected by multiple reflow operations is crucial for the implementation of any reuse strategy. Therefore, various types of 1206 multilayer ceramic capacitors (MLCCs) differing in their capacitance value and dielectric type (X5R,… Show more
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