The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging

Ferguson, Timothy P.; Qu, Jianmin

doi:10.1007/0-387-32989-7_37

Cited by 10 publications

(4 citation statements)

References 43 publications

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“…Adhesion strength loss at the more hydrophobic interfaces was likely due to the moisture-induced degradation of the epoxy elastic modulus. Absorbed water can reduce the elastic modulus of epoxy by acting as a plasticizer and by hydrolyzing bonds . Plasticization and hydrolysis reactions in epoxy can both result in molecular structural changes of the epoxy polymer chains, which in turn can alter the molecular structure of adhesive interfaces, so the interfacial and bulk effects of epoxy moisture uptake are often related.…”

Section: Resultsmentioning

confidence: 99%

Hygrothermal Aging Effects on Buried Molecular Structures at Epoxy Interfaces

et al. 2013

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Interfacial properties such as adhesion are determined by interfacial molecular structures. Adhesive interfaces in microelectronic packages that include organic polymers such as epoxy are susceptible to delamination during accelerated stress testing. Infrared-visible sum frequency generation vibrational spectroscopy (SFG) and attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) were used to study molecular structures at buried epoxy interfaces during hygrothermal aging to relate molecular structural changes at buried interfaces to decreases in macroscopic adhesion strength. SFG peaks associated with strongly hydrogen bonded water were detected at hydrophilic epoxy interfaces. Ordered interfacial water was also correlated to large decreases in interfacial adhesion strength that occurred as a result of hygrothermal aging, which suggests that water diffused to the interface and replaced original hydrogen bond networks. No water peaks were observed at hydrophobic epoxy interfaces, which was correlated with a much smaller decrease in adhesion strength from the same aging process. ATR-FTIR water signals observed in the epoxy bulk were mainly contributed by relatively weakly hydrogen bonded water molecules, which suggests that the bulk and interfacial water structure was different. Changes in interfacial methyl structures were observed regardless of the interfacial hydrophobicity which could be due to water acting as a plasticizer that restructured both the bulk and interfacial molecular structure. This research demonstrates that SFG studies of molecular structural changes at buried epoxy interfaces during hygrothermal aging can contribute to the understanding of moisture-induced failure mechanisms in electronic packages that contain organic adhesives.

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Section: Resultsmentioning

confidence: 99%

Hygrothermal Aging Effects on Buried Molecular Structures at Epoxy Interfaces

et al. 2013

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“…The properties of the polymer can degrade with moisture—an effect of hydrolysis that lowers the bond strength and can cause cohesive failure ( 31 ). It has also been shown that the elastic modulus of an epoxy adhesive decreases as the water uptake (or concentration) of the material increases ( 32 ).…”

Section: Literature Reviewmentioning

confidence: 99%

“…More problematically, interfacial failure between a sealant and a substrate—a condition that usually occurs before a sealant failure—is accelerated by moisture content. For example, interfacial failure toughness between an epoxy adhesive and substrate (copper) has been shown to decrease with increasing water concentration within the epoxy ( 32 ). This is a consequence of the existence of water on the surface or at an interface between the adhesive and substrate.…”

Section: Literature Reviewmentioning

confidence: 99%

Experimental Study of the Effects of Moisture on the Performance of Concrete Pavement Joint Sealants

Kim

Zollinger

Cho

2022

Transportation Research Record: Journal of the Transportation R

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Joint sealants play an important role in maintaining concrete pavement. They reduce or prevent numerous distresses, including spalling, faulting, and subbase erosion damage. The successful maintenance of such joint sealants is closely linked to a satisfactory lifespan for rigid pavement. However, it has been found that many sealants often fail in the early stages, as a result of inadequate or insufficient joint preparation. This study examined the effects of moisture content on bond strength, the main cause of joint sealant failure. Sealant use in various climatic regions throughout the United States was examined and Departments of Transportation were surveyed with regard to how they handled moisture. The survey showed that in cold-freeze areas, hot-pour sealants were preferred over silicone, and most states visually inspected the moisture condition of joint reservoirs. This research evaluated the effects of surface moisture on the tensile bond strength between a joint sealant and reservoir. In addition, an indirect measurement method was applied to estimate the reduction in bond strength in response to excessive moisture on the reservoir wall at the allowable strain. The causes of degradation in adhesion strength were evaluated by measuring the sealant wetting angle. Finally, it was determined that, while the choice of sealant may depend on the climate, those not currently preferred in wet-freeze regions could be used if accompanied by proper pretreatment and moisture control, contributing to the stable lifespan of joint sealants and concrete pavement alike.

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“…It is well known that long-term exposure to high temperature and moisture conditions, as well as the presence of moisture at the interface, can lead to a decrease in the adhesion strength of an interface [13][14][15][16]. To fully characterize the reliability of the interface, testing is typically performed at as-manufactured and environmentally degraded conditions such as thermal aging, moisture absorption, etc.…”

Section: Introductionmentioning

confidence: 99%

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

Mahan

Rosen

Han

2016

Journal of Electronic Packaging

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A blister testing procedure combined with a numerical procedure can be used effectively for characterizing the adhesion strength. A challenge arises when it is implemented after subjecting samples to various environmental conditions. The concept of pseudoproperty is introduced to cope with the problem associated with property changes during environmental testing. The pseudoproperty set is determined directly from a deflection versus pressure curve obtained from a typical blister test. A classical energy balance approach is followed to evaluate the energy release rate from the critical pressure and pseudoproperty set. The proposed approach is carried out for an epoxy/copper interface after subjecting samples to full moisture saturation and a high temperature storage condition. In spite of significant change in property, the energy release rates are calculated accurately without extra tests for property measurements.

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The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging

Cited by 10 publications

References 43 publications

Hygrothermal Aging Effects on Buried Molecular Structures at Epoxy Interfaces

Hygrothermal Aging Effects on Buried Molecular Structures at Epoxy Interfaces

Experimental Study of the Effects of Moisture on the Performance of Concrete Pavement Joint Sealants

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

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