The effect of large oxygen additions on the wettability and work of adhesion of copper-oxygen alloys on polycrystalline alumina

Meier, Alan; Baldwin, Michael; Chidambaram, P.R.; Edwards, G.R.

doi:10.1016/0921-5093(94)09685-6

Cited by 20 publications

(13 citation statements)

References 14 publications

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“…Meier et al 23 observed a contact angle of 12°for oxygen-rich copper with a composition close to Cu 2 O. Within the miscibility gap, a constant wetting angle of ∼25°was measured.…”

Section: Introductionmentioning

confidence: 97%

Influence of Oxygen Partial Pressure and Oxygen Content on the Wettability in the Copper–Oxygen–Alumina System

Diemer

Neubrand

Trumble

et al. 1999

Journal of the American Ceramic Society

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The influence of oxygen on the wetting behavior of copper on single-crystal Al 2 O 3 has been studied. By controlling the oxygen partial pressure ( p O 2 ) and oxygen content in the copper simultaneously, contact angle can be varied between 125°and 22°. Evaluation of the Gibbs adsorption equation for the liquid/solid interface at 1300°C suggests that adsorption of a Cu-O complex at that interface plays a key role in promoting wetting. Formation of CuAlO 2 and dissolution of Al 2 O 3 in the melt also influence the contact angle, especially in the range of p O 2 > 10 −5 bar (1 Pa).

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“…Meier et al 23 observed a contact angle of 12°for oxygen-rich copper with a composition close to Cu 2 O. Within the miscibility gap, a constant wetting angle of ∼25°was measured.…”

Section: Introductionmentioning

confidence: 97%

Influence of Oxygen Partial Pressure and Oxygen Content on the Wettability in the Copper–Oxygen–Alumina System

Diemer

Neubrand

Trumble

et al. 1999

Journal of the American Ceramic Society

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“…The wetting behavior of copper (and its alloys) on alumina has been widely studied because of its relevance to metallization of alumina substrates in the fabrication of microelectronic devices [11][12][13][14][15][16][17][18][19][20]. It is generally accepted that the presence of oxygen has a critical influence on the wetting behavior [13][14][15][16][17]. In the course of exploratory studies aimed at achieving alumina samples with wetting Cu-rich phases at the grain boundaries, mixtures of high purity alumina and Cu 2 O powders were pressureless sintered in air.…”

Section: Introductionmentioning

confidence: 99%

Novel interpenetrating Cu–Al2O3 structures by controlled reduction of bulk CuAlO2

et al. 2014

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Bulk CuAlO 2 with the delafossite structure was processed using two different methods. In one case, stoichiometric CuAlO 2 powder was processed using the solution technique, and consolidation was carried out by pressureless sintering in air. In the second case, high purity starting powders of alumina and copper (I) oxide were consolidated by spark plasma sintering. The sintered body was then subjected to a high temperature anneal in air. Reduction of the bulk CuAlO 2 samples resulted in a novel composite microstructure with copper forming a continuous intergranular phase. The prior CuAlO 2 grains decomposed into an intimate two-phase mixture of metallic copper and h-alumina. The scale of the composite structures ranged from nanometers to microns. Previous work on the delafossite family has focused primarily on the electronic properties of thin films. The present study suggests that the reduction of this class of mixed oxides gives rise to metal-ceramic structures with unique interfacial and morphological properties.

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“…Oxygen partial pressure plays an important role on the wettability of a melt on a ceramic. Similarly, case studies on investigating the influence of oxygen partial pressure and oxygen content on the wettability of the copper‐oxygen‐alumina system have previously been undertaken . Oxygen‐promoted wetting of liquid copper to alumina has been completed by the copper‐cuprous oxide (Cu‐Cu 2 O) eutectic reaction under an oxygen partial pressure of 2 Pa without any external load.…”

Section: Resultsmentioning

confidence: 99%

Cu/LaCrO₃joining by local melt infiltration through laser cladding

et al. 2018

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Direct bonding of copper and porous LaCrO3 without an extra filler interlayer was successfully completed using local and fast Cu‐infiltration through laser cladding. This significantly reduced the susceptibility of the ceramic to cracking. A high‐speed camera investigation into the wetting and infiltration behavior of a Cu‐melt into LaCrO3 with a porosity of ~63 vol% was performed. By adjusting the focal distance with a constant laser power of 300 W, the Cu‐melt was rapidly infiltrated into the ceramic preform in 10 seconds. This was completed under atmospheric air conditions, without added inert gas. The joining process developed can be used to fabricate ceramic/metal joints with targeted (micro‐) structure properties by adjusting the infiltrated melt and the infiltration depth, which would be suitable for many applications, such as multifunctional devices, solid oxide fuel cells or heating elements.

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The effect of large oxygen additions on the wettability and work of adhesion of copper-oxygen alloys on polycrystalline alumina

Cited by 20 publications

References 14 publications

Influence of Oxygen Partial Pressure and Oxygen Content on the Wettability in the Copper–Oxygen–Alumina System

Influence of Oxygen Partial Pressure and Oxygen Content on the Wettability in the Copper–Oxygen–Alumina System

Novel interpenetrating Cu–Al2O3 structures by controlled reduction of bulk CuAlO2

Cu/LaCrO₃joining by local melt infiltration through laser cladding

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The effect of large oxygen additions on the wettability and work of adhesion of copper-oxygen alloys on polycrystalline alumina

Cited by 20 publications

References 14 publications

Influence of Oxygen Partial Pressure and Oxygen Content on the Wettability in the Copper–Oxygen–Alumina System

Influence of Oxygen Partial Pressure and Oxygen Content on the Wettability in the Copper–Oxygen–Alumina System

Novel interpenetrating Cu–Al2O3 structures by controlled reduction of bulk CuAlO2

Cu/LaCrO3joining by local melt infiltration through laser cladding

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Product

Resources

About

Cu/LaCrO₃joining by local melt infiltration through laser cladding