The Effect of Internal Stress on the Fatigue and Corrosion-Fatigue Properties of Electroplated and Chemically Plated Nickel Deposits

Spähn, H.

doi:10.1080/00202967.1964.11869947

Cited by 13 publications

(2 citation statements)

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“…The outward bowing of the side walls indicates a compressive stress in the copper layer. Stress development has been previously reported in electroless plating. − One course for mitigation of the deformation is to increase the elastic modulus of the UV-curable imprint material. The UV-curable imprint material, NOA-73, has a relatively low modulus of elasticity (1600 psi or 11 MPa) and hardness (60 Shore D).…”

Section: Resultsmentioning

confidence: 99%

Self-Aligned Capillarity-Assisted Printing of High Aspect Ratio Flexible Metal Conductors: Optimizing Ink Flow, Plating, and Mechanical Adhesion

Jochem

Kolliopoulos

Bidoky

et al. 2020

Ind. Eng. Chem. Res.

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High-resolution, low-resistance, flexible metal interconnects that are many centimeters long were additively manufactured on plastic substrates using a roll-to-roll compatible print and plate process. Connected networks of ink-receiving reservoirs and capillary microchannels were first roll-to-roll molded on plastic films. Silver ink was jetted into the easily-targeted inkreceiving reservoirs, and the connected microchannels were fed and coated with ink by capillary flow and drying. Subsequent electroless plating of copper into the silver-coated channels created solid, high aspect ratio conductive traces. Processing windows for uniform silver deposition were identified as a function of ambient humidity, ink flow time, and channel geometry. Plating conditions were also optimized to alleviate copper stress development and debonding and to allow conductor flexibility. Overall, the optimized print-and-plate process is promising for additively manufacturing micron-scale, high aspect ratio (>1), low-resistance (linear resistance ∼1 Ω/cm) conductors embedded in plastic, addressing a long-standing fabrication challenge for flexible printed electronics.

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Section: Resultsmentioning

confidence: 99%

Self-Aligned Capillarity-Assisted Printing of High Aspect Ratio Flexible Metal Conductors: Optimizing Ink Flow, Plating, and Mechanical Adhesion

Jochem

Kolliopoulos

Bidoky

et al. 2020

Ind. Eng. Chem. Res.

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“…It has been reported that EN exposure to temperatures above 220 °C causes reduction in strength and this can destroy the ductility [11,32,33,34,35]. Usually, hardening type of heat treatments reduce both ductility and the strength of EN deposits, hence the coating breaks and resulted in high corrosion rate.…”

Section: Corrosion Resistance Studies Of Mild Carbon Steel Substratesmentioning

confidence: 99%

Corrosion of Heat Treated Electroless-Ni Plated Mild Carbon Steels in Dilute H<sub>2</sub>SO<sub>4</sub>

Ajibola

Adebayo

Oloruntoba

2015

IJMSA

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Abstract:The corrosion of heat-treated Electroless-Nickel (EN) plated mild carbon steel (MCS) in dilute H 2 SO 4 is investigated and reported in the study. The MCS samples were electroless-Ni plated in alkaline Nimudeen 850. EN plated samples were soaked at different selected temperatures between 150-370 °C at constant time. The weight loss of the specimens by full immersion method was employed to assess the corrosion damage and corrosion rates of the as-received, EN plated MCS and four heat treated EN plated samples in the 0.5 M H 2 SO 4 solution. The test specimens were regularly examined at every 12 hrs interval for 30 days (720 hrs). The materials corrodes in 0.5 M H 2 SO 4 in the order of MCS10 > MCS14 > MCS15 > MCS11 > MCS13 > MCS12. Based on the results obtained, it will be justified to choose EN-plated samples (MCS 11) and the heat treated EN film (MCS12 and MCS13) for the purposed of solving the problem of corrosion in the medium. This is because; the application of EN deposition reduced the corrosion of MCS at much lower rate than the heat-treated EN film (MCS14 and MCS15) in 0.5 M H 2 SO 4 environment. Atomic Absorption Spectrometer (AAS) Thermo series 2000 model and Scanning Electron Microscopy (SEM) with the Energy Dispersive X-Ray (EDX) facilities (Jeol JSM-7600F model) were used to ascertain the chemical compositions and the microstructures of samples.

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An overall aspect of electroless Ni-P depositions—A review article

Krishnan

John

Srinivasan

et al. 2006

Metall Mater Trans A

321

154

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Literatureo ne lectroless Ni-P deposition, in recent decades, has dwelled primarily on surface engineering and corrosion-resistant applications. By contrast, we havemany researcharticles devoted to the engineering aspects of the electroless Ni-P depositions and their technology. The present article deals with the development of electroless Ni-P bath,a dvantages and mechanisms of deposition, and applications of the Ni-P deposits. We also present acomparison of the properties of electroless Ni-P and Ni-B as well as the recent developments in nickel-phosphorous research. We attempt to review these in ad etailed manner.W ea lso briefly discuss the future developments of electroless Ni-P.

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The Effect of Internal Stress on the Fatigue and Corrosion-Fatigue Properties of Electroplated and Chemically Plated Nickel Deposits

Cited by 13 publications

References 1 publication

Self-Aligned Capillarity-Assisted Printing of High Aspect Ratio Flexible Metal Conductors: Optimizing Ink Flow, Plating, and Mechanical Adhesion

Self-Aligned Capillarity-Assisted Printing of High Aspect Ratio Flexible Metal Conductors: Optimizing Ink Flow, Plating, and Mechanical Adhesion

Corrosion of Heat Treated Electroless-Ni Plated Mild Carbon Steels in Dilute H<sub>2</sub>SO<sub>4</sub>

An overall aspect of electroless Ni-P depositions—A review article

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The Effect of Internal Stress on the Fatigue and Corrosion-Fatigue Properties of Electroplated and Chemically Plated Nickel Deposits

Cited by 13 publications

References 1 publication

Self-Aligned Capillarity-Assisted Printing of High Aspect Ratio Flexible Metal Conductors: Optimizing Ink Flow, Plating, and Mechanical Adhesion

Self-Aligned Capillarity-Assisted Printing of High Aspect Ratio Flexible Metal Conductors: Optimizing Ink Flow, Plating, and Mechanical Adhesion

Corrosion of Heat Treated Electroless-Ni Plated Mild Carbon Steels in Dilute H&lt;sub&gt;2&lt;/sub&gt;SO&lt;sub&gt;4&lt;/sub&gt;

An overall aspect of electroless Ni-P depositions—A review article

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Corrosion of Heat Treated Electroless-Ni Plated Mild Carbon Steels in Dilute H<sub>2</sub>SO<sub>4</sub>