The Effect of Green Flame Retardants on the Properties of Encapsulation Molding Compounds

Liaw, Yowching; Yen, Hsing Yuan; Chou, Jung-Hua

doi:10.1109/tcpmt.2017.2735187

Cited by 3 publications

(2 citation statements)

References 27 publications

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“…However, the halogen-containing resins and antimony oxide-based flame retardants, are harmful to both the environment and human health . The alternatives like phosphorus, nitride, and metal oxides, while often face challenges such as poor compatibility with resin matrix or high cost . In the past decades, the resins with intrinsic halogen-free flame retardancy have been successfully developed and widely used for fabricating EMC, including 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO)-modified epoxy resins, and biphenyl and aralkyl epoxy/phenolic resins, whereas the produced EMC usually exhibit lowered T g or thermal stability after curing .…”

Section: Introductionmentioning

confidence: 99%

“…11 The alternatives like phosphorus, nitride, and metal oxides, while often face challenges such as poor compatibility with resin matrix or high cost. 12 In the past decades, the resins with intrinsic halogenfree flame retardancy have been successfully developed and widely used for fabricating EMC, including 9,10-dihydro-9oxa-10-phosphaphenanthrene-10-oxide (DOPO)-modified epoxy resins, and biphenyl and aralkyl epoxy/phenolic resins, whereas the produced EMC usually exhibit lowered T g or thermal stability after curing. 13 Hence, developing packaging materials for high-power devices with excellent thermal stability and intrinsic halogen-free flame retardancy holds significant research importance and an application outlook.…”

Section: Introductionmentioning

confidence: 99%

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Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy

Huang,

Zhu,

et al. 2024

Ind. Eng. Chem. Res.

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The rapid development of third-generation semiconductor power devices has been driving the requirement for high-temperature stable molding compounds. In this study, three kinds of phthalonitrile-etherified phenolic resins (PNP) with different degrees of etherification were prepared from linear phenolic resin and 4-nitrophthalonitrile by a facile one-pot method. Subsequently, a new electronic packaging molding compound (PEM) was prepared according to the processing method of traditional epoxy molding compounds (EMC), based on the resin blends of the PNP with a 50% etherification and polyfunctional epoxy resin as the resin matrix and triphenylphosphine employed as the curing accelerator. The reaction of the epoxy groups with both the phenol hydroxyl and cyano groups endowed the resin matrix with a high curing activity, thus making the molding process of PEM be compatible with that of EMC. The cured products of PEM showed a much superior thermal performance to that of EMC. For the cured PEM, the glass transition temperature (T g) was up to 300 °C and the coefficients of thermal expansion (CTE) decreased significantly in comparison to EMC, due to the generated rigid structures of oxazoline, isoindoline, triazine, and phthalocyanine, as well as the high cross-linking density. It is worth noting that the cured PEM could achieve a V-0 rating in the UL-94 vertical burning test without the addition of any flame retardants, demonstrating its remarkable intrinsic flame retardancy. Moreover, the cured PEM also exhibited good dielectric properties, thermal conductivity, high temperature aging resistance, and flexural performance at both room temperature and 200 °C. In sum, a promising strategy for the preparation of electronic packaging molding compounds with high T g, low CTE, and intrinsic flame retardancy was provided.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy

Huang,

Zhu,

et al. 2024

Ind. Eng. Chem. Res.

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Molding compounds based on aminophenoxyphthalonitrile/epoxy resin for high-temperature electronic packaging applications

Huang,

Zhu,

et al. 2024

Reactive and Functional Polymers

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Effect of Molding Cure Time on High Density Quad-Flat-No Lead Sawn Package

Jalal

Ansari

Atiqah

2021

IOP Conf. Ser.: Mater. Sci. Eng.

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Quad Flat No Lead (QFN) is part of an integrated circuit (IC) products that required wire bonding and molding as part of its packaging process. There are many types of QFN packages thickness available in the market and 0.75 mm thickness is one of the highest in demand. The wireless (WLSS) QFN package was used in this research for the mobility of electronics devices especially for wireless technology such as mobile phone and laptop. The objective of this paper is to study the effect of molding cure time at 100 and 130 s of WLSS QFN package. Besides, two variations of package size of 2.5 mm x 2.5 mm and 7.0 mm x 7.0 mm were undergoing each process in QFN packaging stages to adhere to the real manufacturing environment. For characterization, 4 types of QFN package were examined for its moldability through C-CSAM, reliability and electrical test were also carried out according to the Joint Electron Device Engineering Council (JEDEC) requirements. From the result, it was found that the optimum molding cure time is 100 s is suitable for molding the WLSS QFN package. This new curing temperature can be can increase productivity for about 8% for QFN packaging.

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The Effect of Green Flame Retardants on the Properties of Encapsulation Molding Compounds

Cited by 3 publications

References 27 publications

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy

Molding compounds based on aminophenoxyphthalonitrile/epoxy resin for high-temperature electronic packaging applications

Effect of Molding Cure Time on High Density Quad-Flat-No Lead Sawn Package

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The Effect of Green Flame Retardants on the Properties of Encapsulation Molding Compounds

Cited by 3 publications

References 27 publications

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High Tg, Low CTE, and Intrinsic Flame Retardancy

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High Tg, Low CTE, and Intrinsic Flame Retardancy

Molding compounds based on aminophenoxyphthalonitrile/epoxy resin for high-temperature electronic packaging applications

Effect of Molding Cure Time on High Density Quad-Flat-No Lead Sawn Package

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Product

Resources

About

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy