The Effect of Grain Size on the Diffusion Bonding Properties of SP700 Alloy

Abstract

Superplastic forming and diffusion bonding (SPF/DB) has been recognized as a viable manufacturing technology. However, the basic understanding of grain size and its effects on the quality of diffusion bonds is still limited. In this study, a certain type of SP700 alloy with different grain sizes is bonded at superplastic temperature. The experimental results indicate that the same materials, if coarse-grained, may not readily bond under identical conditions of pressure, temperature, and time. This type of bonding is possible because of the presence of many grain boundaries in fine-grained materials that act as short-circuit paths for diffusion. In addition, grain-boundary migration is also faster in fine-grained than in coarse-grained materials. Fractographic studies show that the dimples on the coarse-grained specimen have large dimensions compared with that in the fine-grained material, indicating that heterogeneous deformation develops in the coarse-grained specimen during tension.