The effect of grain boundary structure on sensitization behavior in a nickel-based superalloy

Sahu, Sandeep; Sharma, Nitin Kumar; Patel, Sanjeev; Mondal, K.; Shekhar, Shashank

doi:10.1007/s10853-018-2919-7

Cited by 17 publications

(3 citation statements)

References 63 publications

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“…Despite the influence of CSL grain boundaries on the variation of mechanical and electrical properties demonstrated in the present article, some researchers [57,56] also attribute these modifications to other phenomena like the ideal misorientation and triple junction distribution. However, since the main objective of this research was to identify the influence of CSL-GB on hardness and electrical conductivity, other factors were out of the scope of this study.…”

Section: Resultsmentioning

confidence: 56%

Influence of microstructure on the hardness and electrical conductivity of CuCrZr alloy submitted to ECAP followed by aging and rotary swaging

Sousa,

Pires,

Cruz

et al. 2024

Matéria (Rio J.)

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Grain boundaries are fundamental in the mechanical behavior of ultrafine grain materials, especially coincidence site lattice grain boundaries (CSL-GB). This research aims to identify the influence of CSL-GB on the hardness and electrical conductivity of a CuCrZr alloy subjected to rotary swaging after having undergone severe plastic deformation via equal channel angular pressing and aging. Vickers hardness was evaluated, and electrical conductivity was measured using the 4-point technique. The average grain size and CSL-GB distribution were identified using backscattered electron diffraction. Dislocation density was measured via X-ray diffraction. At the end of the swaging processing of CuCrZr alloy with preexistent ultrafine grains, the dislocation density ceases to be the significant influencer parameter on the modification of properties, and the grain boundaries pass to be more impacting. The reduction of CSL-GB and the concomitant increase in high-angle grain boundaries can decrease hardness and electrical conductivity.

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Section: Resultsmentioning

confidence: 56%

Influence of microstructure on the hardness and electrical conductivity of CuCrZr alloy submitted to ECAP followed by aging and rotary swaging

Sousa,

Pires,

Cruz

et al. 2024

Matéria (Rio J.)

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“…The gradual change in the point to origin misorientation as a function of distance from the base depicts the formation of low-angle boundaries and deformation bands in the matrix, while the plateaus in the plot (highlighted by arrows in Figure 6 e) correspond to the large-angle boundaries. 61 , 62 This means that this region is still at an early stage of dynamic recrystallization and the crystal lattice is severely deformed. The point-to-point misorientation profile (red line in Figure 6 e) shows spikes in the region close to the surface, suggesting the formation of NC grains with large-angle boundaries; that is, dynamic recrystallization has already finished.…”

Section: Resultsmentioning

confidence: 99%

Extended Shear Deformation of the Immiscible Cu–Nb Alloy Resulting in Nanostructuring and Oxygen Ingress with Enhancement in Mechanical Properties

Gwalani

Pang

et al. 2022

ACS Omega

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Deformation processing of immiscible systems is observed to disrupt thermodynamic equilibrium, often resulting in nonequilibrium microstructures. The microstructural changes including nanostructuring, hierarchical distribution of phases, localized solute supersaturation, and oxygen ingress result from high-strain extended deformation, causing a significant change in mechanical properties. Because of the dynamic evolution of the material under large strain shear load, a detailed understanding of the transformation pathway has not been established. Additionally, the influence of these microstructural changes on mechanical properties is also not well characterized. Here, an immiscible Cu-4 at. % Nb alloy is subjected to a high-strain shear deformation (∼200); the deformation-induced changes in the morphology, crystal structure, and composition of Cu and Nb phases as a function of total strain are characterized using transmission electron microscopy and atom probe tomography. Furthermore, a multimodal experiment-guided computational approach is used to depict the initiation of deformation by an increase in misorientation boundaries by crystal plasticity-based grain misorientation modeling (strain ∼0.6). Then, co-deformation and nanolamination of Cu and Nb are envisaged by a finite element method-based computational fluid dynamic model with strain ranging from 10 to 200. Finally, the experimentally observed amorphization of the severely sheared supersaturated Cu–Nb–O phase was validated using the first principle-based simulation using density functional theory while highlighting the influence of oxygen ingress during deformation. Furthermore, the nanocrystalline microstructure shows a >2-fold increase in hardness and compressive yield strength of the alloy, elucidating the potential of deformation processing to obtain high-strength low-alloyed metals. Our approach presents a step-by-step evolution of a microstructure in an immiscible alloy undergoing severe shear deformation, which is broadly applicable to materials processing based on friction stir, extrusion, rolling, and surface shear deformation under wear and can be directly applied to understanding material behavior during these processes.

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“…Grain boundary is of prime importance because of their physical significance when associated with the processes of DRX, especially in the case of dislocation behavior during hot compression . On the one hand, grain boundary can absorb dislocation constantly during hot deformation of nickel‐based superalloy.…”

Section: Discussionmentioning

confidence: 99%

Texture Evolution and Dislocation Behavior in a Nickel‐Based Superalloy during Hot Compression

Gao

Jia

Ji³

et al. 2019

Adv Eng Mater

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Texture evolution and dislocation behavior of Ni‐based superalloys at various temperatures and strain rate of 1 s−1 are studied using electron backscatter diffraction (EBSD) technique and transmission electron microscope (TEM). It can be concluded that no significant texture is formed at high deformation temperature, especially for the occurrence of completed dynamic recrystallization (DRX). In addition, texture weakening is easy to realize by conducting DRX process on the Ni‐based superalloys, whereas a slight strengthening is observed during grain growth. Based on the TEM images, the original grain boundary with high orientation gradient at low temperature provides an excellent position for DRX nuclei, which is strongly related with the dislocation motion. Moreover, it is concluded that the dislocation behavior plays a significant role in the plastic deformation of the Ni‐based superalloys. Herein, theoretical guidance for the application of nickel‐based superalloys and furthermore enhancement of their plastic deformation properties is provided.

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The effect of grain boundary structure on sensitization behavior in a nickel-based superalloy

Cited by 17 publications

References 63 publications

Influence of microstructure on the hardness and electrical conductivity of CuCrZr alloy submitted to ECAP followed by aging and rotary swaging

Influence of microstructure on the hardness and electrical conductivity of CuCrZr alloy submitted to ECAP followed by aging and rotary swaging

Extended Shear Deformation of the Immiscible Cu–Nb Alloy Resulting in Nanostructuring and Oxygen Ingress with Enhancement in Mechanical Properties

Texture Evolution and Dislocation Behavior in a Nickel‐Based Superalloy during Hot Compression

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